参数资料
型号: BA33JC5T
厂商: Rohm Semiconductor
文件页数: 8/16页
文件大小: 0K
描述: IC REG LDO 3.3V 1.5A TO220FP
标准包装: 50
稳压器拓扑结构: 正,固定式
输出电压: 3.3V
输入电压: 最高 16V
电压 - 压降(标准): 0.3V @ 200mA
稳压器数量: 1
电流 - 输出: 1.5A(最小值)
工作温度: -40°C ~ 105°C
安装类型: 通孔
封装/外壳: TO-220-3 整包
供应商设备封装: TO-220FP
包装: 带卷 (TR)
BAxxJC5 Series(Fixed)
BA00JC5WT(Variable)
Datasheet
● I/O equivalence circuit
Vcc
* For the BA00JC5WT, connect R1 and R2
Vcc
externally between the ADJ and GND pins
and between the OUT and ADJ pins.
CTL
27k Ω
2k Ω
31k Ω
R2
R1
OUT
Equation: V O = Vc × (R1 + R2) / R1
(Vc = 1.25V (Typ.))
The recommended R1 value is approximately
30 k Ω to 150 k Ω .
Fig.15
● Power Dissipation
? TO220FP-3/TO220FP-5
Fig.16
25
(1) When using an infinite heat sink.
θ j-c = 6.25 (°C/W)
20
(1)20.0
(2) During IC without heat sink operation.
θ j-a = 62.5 (°C/W)
15
10
5
(2)2.0
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE : Ta [ °C ]
Fig.17
The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum
junction temperature T jmax , deterioration or damage may occur. Implement proper thermal designs to ensure that power
dissipation is within the permissible range in order to prevent instantaneous damage resulting from heat and maintain the
reliability of the IC for long-term operation.
The following method is used to calculate the power consumption Pc (W):
Pd ? Vcc × Icca
Vcc ? Vo
Pc = (Vcc – Vo) × Io + Vcc × Icca
Power dissipation Pd ≥ Pc
The load current Io is calculated:
Io ≤
Calculation Example:
Vcc = 6.0V and Vo = 5.0V at Ta = 85 ℃
Vcc
Vo
I O
Icca
: Input voltage
: Output current
: Load current
: Circuit current
Io ≤
1.040 ? 6.0 × Icca
6.0 ? 5.0
θ ja = 62.5°C/W → ? 16.0mW/°C
25°C = 2000mW → 85°C = 1040mW
Io ≤ 860mA (Icca ≈ 30mA)
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
8/13
TSZ02201-0R6R0A600140-1-2
14.Feb.2012 Rev.001
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