参数资料
型号: BBS-109-G-A
厂商: Samtec Inc
文件页数: 1/1页
文件大小: 0K
描述: CONN HEADER 9POS .100 PCB GOLD
产品培训模块: Board-to-Board Connectors
产品目录绘图: BBS Series
特色产品: Board-To-Board Interconnect Systems
标准包装: 1
系列: BBS
连接器类型: 无罩
位置数: 9
加载位置的数目: 全部
间距: 0.100"(2.54mm)
行数: 1
超出电路板的模制高度: 0.210"(5.33mm)
触点接合长度: 0.125"(3.18mm)
安装类型: 通孔
端子: 焊接
触点表面涂层:
触点涂层厚度: 20µin(0.51µm)
颜色:
包装: 散装
配套产品: SAM1126-09-ND - CONN RCPT .100" 9POS TIN WW R/A
SAM1125-09-ND - CONN RCPT .100" 9POS TIN WW
SAM1124-09-ND - CONN RCPT .100" 9POS GOLD WW R/A
SAM1123-09-ND - CONN RCPT .100" 9POS GOLD WW
SAM1122-09-ND - CONN RCPT .100" 9POS TIN PCB
SAM1121-09-ND - CONN RCPT .100" 9POS GOLD PCB
SAM1120-09-ND - CONN RCPT .100" 9POS TIN T/H
SAM1119-09-ND - CONN RCPT .100" 9POS TIN T/H
SAM1118-09-ND - CONN RCPT .100" 9POS GOLD T/H
SAM1117-09-ND - CONN RCPT .100" 9POS GOLD T/H
更多...
其它名称: SAM1004-09
BBS–116–G–C
F-214
BDL–120–T–F
BBL
(3.89 mm)
.153"
SL
BBS–108–T–A
(2,54 mm) .100"
BBS–120–T–B
BBS, BBL, BHS, BBD, BDL SERIES
MACHINED BOARD STACKING STRIPS
Mates with:
SS, SD, HSS, SL, SDL,
ESS, ESD
TYPE
STRIP
1
NO. PINS
PER ROW
PLATING
OPTION
LEAD
STYLE
FEATURES
? Low pro?le design
(1,27)
achieves (3,89 mm)
.153" board spacings
when mated with SL
Series.
? Approach the reliability
of a permanent
connection with the
?exibility of a separable
connection.
SPECIFICATIONS
BBS
= Standard Single Row
BBL
= Low Pro?le Single Row
BHS
= High Temp Single Row
(2,54)
.100
(2,54)
.100
(2,54) .100 x No. of Positions
(2,54) .100 TYP
.050
BBL body available with
Styles –E & –F only.
BBS
BHS BBL
–G
=20 μ" (0,51 μm)
Gold
–T
=Tin
For complete speci?cations
see www.samtec.com?BBS,
(2,54) .100 x No. of Positions
www.samtec.com?BBL,
www.samtec.com?BHS
www.samtec.com?BBD or
www.samtec.com?BDL
Insulator Material:
Black Glass Filled Polyester
(BBS, BBD, BBL)
Black High Temp Nylon
(BDL)
Black Liquid Crystal Polymer
(BHS)
Temperature Range:
-55°C to +125°C
BBD
= Standard Double Row
BDL
= Low Pro?le Double Row
(5,08)
.200
(2,54)
.100
(2,54)
.100
(2,54) .100 TYP
(1,27)
.050
BDL body available with
Styles –E & –F only.
BDL
BBD
01 thru 32
= BBS & BBL
01 thru 36
= BBD, BDL & BHS
Terminal Material:
Phosphor Bronze or Brass
Plating:
Au or Sn over 50μ" (1,27 μm) Ni
RoHS Compliant:
Yes
Lead-Free Solderable:
Wave only
–A
Z = (5,33 mm) .210"
–B
Z = (8,51 mm) .335"
–C
Z = (14,86 mm) .585"
–E
Z = (1,78 mm) .070"
–F
Z = (2,16 mm) .085"
(BBS, BBD, BBL, BDL))
Wave, or re?ow with
all Au (BHS)
RECOGNITIONS
Style E:
(2,74)
.108
Style F:
(3,18)
.125
For complete scope
of recognitions see
www.samtec.com/quality
(3,18)
.125
(0,46)
.018
DIA
(1,27)
.050
(1,78)
(0,46)
.018 DIA
Z
(1,78)
.070
DIA
Z
.070 DIA
(0,46)
.018 DIA
BBL
(3,18)
.125
Series
(3,18)
.125
(1,27)
.050 DIA
(0,46)
Note: Some lengths, styles
and options are non-standard,
non-returnable.
.018
DIA
BBS and BHS
Series
BBD
Series
BDL
Series
Z
WWW.SAMTEC.COM
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BBS-109-G-B 制造商:Samtec Inc 功能描述:CONN UNSHRD HDR HDR 9 POS 2.54MM SLDR ST TH - Bulk 制造商:Samtec Inc 功能描述:HEADER, 2.54MM, PCB, 1X9WAY 制造商:Samtec Inc 功能描述:HEADER, 2.54MM, PCB, 1X9POS; Series:-; Pitch Spacing:2.54mm; No. of Rows:1; No. of Contacts:9; Gender:Header; Contact Termination:Solder; Contact Plating:Gold; Contact Material:Phosphor Bronze ;RoHS Compliant: Yes
BBS-109-G-C 制造商:Samtec Inc 功能描述:CONN UNSHRD HDR HDR 9 POS 2.54MM SLDR ST TH - Bulk 制造商:Samtec Inc 功能描述:HEADER, 2.54MM, PCB, 1X9WAY 制造商:Samtec Inc 功能描述:HEADER, 2.54MM, PCB, 1X9POS; Series:-; Pitch Spacing:2.54mm; No. of Rows:1; No. of Contacts:9; Gender:Header; Contact Termination:Solder; Contact Plating:Gold; Contact Material:Phosphor Bronze ;RoHS Compliant: Yes
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BBS-109-G-G 制造商:Samtec Inc 功能描述:CONN UNSHRD HDR HDR 9 POS 2.54MM SLDR ST TH - Bulk
BBS-109-G-H 制造商:Samtec Inc 功能描述:INTERCONNECT STRIPS - Bulk