参数资料
型号: BCD352F110T300A00
厂商: Vicor Corporation
文件页数: 1/11页
文件大小: 0K
描述: HV BCM BUS CONVERTER EVAL BOARD
产品培训模块: VI Chip Bus Converter Modules
标准包装: 1
系列: V-I Chip™, BCM™
主要目的: DC/DC,步降
输出及类型: 1,隔离
功率 - 输出: 300W
输出电压: 11V
电流 - 输出: 28A
输入电压: 330 ~ 365 V
稳压器拓扑结构: 降压
频率 - 开关: 3.9MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: BCM352F110T300A
其它名称: 1102-1182
BCD352F110T300A00-ND
BCM352F110T300A00
BCM352T110T300A00
(Formerly VIB0001TFJ)
BCM TM
Bus Converter
? 352 V to 11 V V?I Chip TM Converter
? Typical efficiency 95%
? 300 Watt (450 Watt for 1 ms)
? High density – up to 1017 W/in 3
? Small footprint – 260 W/in 2
? Low weight – 0.5 oz (14 g)
? 125°C operation
? <1 μs transient response
? >3.5 million hours MTBF
? No output filtering required
Vin = 330 - 365 V
Vout = 10.3 - 11.4 V
Iout = 28.0 A
?
? ZVS / ZCS isolated sine
amplitude converter
Product Description
K = 1/32
Rout = 12.5 m max
Absolute Maximum Ratings
The V?I Chip bus converter is a high efficiency (>95%),
narrow input range Sine Amplitude Converter TM (SAC TM )
operating from a 330 to 365 Vdc primary bus to deliver
an isolated low voltage secondary. The off-line BCM
provides an isolated 10.3 -11.4 V distribution bus and is
ideal for use in silver boxes and PFC front ends. Due to
the fast response time and low noise of the BCM, the
need for limited life aluminum electrolytic or tantalum
capacitors at the input of POL converters is reduced—or
eliminated—resulting in savings of board area, materials
and total system cost.
The BCM achieves a power density of 1017 W/in 3 in
a V?I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V?I Chip package provides flexible thermal management
through its low junction-to-case and junction-to-board
Parameter
+In to -In
PC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature (1)
Storage temperature
Values
-1.0 to 400
500
-0.3 to 7.0
-0.5 to 16.0
4,242
28
42.0
300
450
225
245
-40 to 125
-40 to 125
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
MSL 5
MSL 6
T-Grade
T-Grade
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction-to-case and junction-to-lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
vicorpower.com
800-735-6200
V?I Chip Bus Converter
BCM352F110T300A00 & BCM352T110T300A00
Rev. 1.6
Page 1 of 11
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