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| 型号： | BCM352T440T330A00 |
| 厂商： | Vicor Corporation |
| 文件页数： | 1/17页 |
| 文件大小： | 0K |
| 描述： | HV BCM BUS CONVERT 44V 325W |
| 应用说明： | Factorized Power Architecture and V-I Chips |
| 产品培训模块： | VI Chip Bus Converter Modules |
| 标准包装： | 1 |
| 系列： | V-I Chip™, BCM™ |
| 类型： | 总线转换器模块 |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 330V |
| 电压 - 输入（最大）： | 365V |
| 输出电压： | 44V |
| 电流 - 输出（最大）： | 7.4A |
| 电源（瓦） - 制造商系列： | 325W |
| 电压 - 隔离： | 4.242kV（4242V） |
| 应用： | 商用 |
| 特点： | 具有远程开/关功能和 UVLO |
| 安装类型： | 通孔 |
| 封装/外壳： | 模块 |
| 尺寸/尺寸： | 1.28" L x 0.87" W x 0.26" H（32.5mm x 22.0mm x 6.7mm） |
| 包装： | 托盘 |
| 工作温度： | -40°C ~ 125°C |
| 效率： | 95.7% |
| 电源（瓦特）- 最大： | 326W |
| 重量： | 0.031 磅（14.06g） |
| 其它名称： | 1102-1140 BCM352T440T330A00-ND |
BCM
BCM352F440T330A00
BCM352T440T330A00
(Formerly VIB0003TFJ)
TM
Bus Converter
S
C
NRTL
US
FEATURES
? 352 Vdc – 44 Vdc 325 W Bus Converter
? High efficiency (>95%) reduces system power
consumption
? High power density (>1000 W/in 3 )
reduces power system footprint by >40%
? “Full Chip” V ? I Chip package enables surface mount,
low impedance interconnect to system board
? Contains built-in protection features: undervoltage,
overvoltage lockout, overcurrent protection, short
circuit protection, overtemperature protection.
? Provides enable/disable control, internal temperature
monitoring
? ZVS/ZCS Resonant Sine Amplitude Converter topology
? Can be paralleled to create multi-kW arrays
DESCRIPTION
The V ? I Chip TM bus converter is a high efficiency (>95%) Sine
Amplitude Converter TM (SAC TM ) operating from a 330 to 365
Vdc primary bus to deliver an isolated 41.25 – 45.63 V nominal,
unregulated secondary. The SAC offers a low AC impedance
beyond the bandwidth of most downstream regulators,
meaning that input capacitance normally located at the input
of a regulator can be located at the input to the SAC. Since the
K factor of the BCM352F440T330A00 is 1/8, that capacitance
value can be reduced by a factor of 64x, resulting in savings of
board area, materials and total system cost.
The BCM352F440T330A00 is provided in a V ? I Chip package
compatible with standard pick-and-place and surface mount
assembly processes. The V ? I Chip package provides flexible
thermal management through its low junction-to-case and
junction-to-board thermal resistance. With high conversion
efficiency the BCM352F440T330A00 increases overall system
efficiency and lowers operating costs compared to
conventional approaches.
TYPICAL APPLICATIONS
? High End Computing Systems
? Automated Test Equipment
? Telecom Base Stations
? High Density Power Supplies
? Communications Systems
TYPICAL APPLICATION
V IN = 330 – 365 V
V OUT = 41.25 – 45.63 V ( NO LOAD )
PART NUMBER
BCM352F440T330A00
VC
VC
PR
SG
P OUT = 325 W( NOM )
K = 1/8
DESCRIPTION
-40°C – 125°C T J , J lead
enable / disable
switch
PC
TM
PC
TM
OS
CD
PC
TM
L
F1
SW1
+In
BCM
+Out
IL
+In
PRM
+Out
+In
VTM
+Out
O
A
V IN
C1
1 μF
D
-In
-Out
-In
-Out
-In
-Out
Rev. 1.7
V?I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
12/2010
Page 1 of 17
v i c o r p o w e r. c o m
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