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参数资料
| 型号： | BD0826J50200AHF |
| 厂商： | Anaren |
| 文件页数： | 4/5页 |
| 文件大小： | 3373K |
| 描述： | XFRMR BALUN RF 800-2600MHZ 0805 |
| 标准包装： | 1 |
| 系列： | Xinger® |
| 频率范围： | 800MHz ~ 2.6GHz |
| 阻抗 - 不平衡/平衡： | 50 / 200 欧姆 |
| 相差： | 3° |
| 插入损耗（最大值）： | 1.5dB |
| 回程损耗（最小值）： | 8.5dB |
| 封装/外壳： | 0805（2012 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 其它名称： | 1173-1058-6 |
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odel B 826J50200AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
Bi F
rin
6x .41
6x .33
.04
4x .25
.66
3x Transmission
lines
Plated thru holes to ground
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Mounting Footprint
Dimensions are in Millimeters
DC Bias Footprint
6x .41
6x .33
.04
4x .25
.66
3x Transmission
lines
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Mounting Footprint
Dimensions are in Millimeters
Capacitor
Plated thru
holes to
ground
DC Bias
相关PDF资料 |
PDF描述 |
|---|---|
| BD1631J50100AHF | XFRMR BALUN RF 1.6-3.1GHZ 0805 |
| BD1722N5050AHF | XFRMR BALUN RF 1700-2200MHZ 0404 |
| BD2425N100ATI | XFRMR BALUN RF 2400-2500MHZ 0404 |
| BD2425N50100AHF | XFRMR BALUN RF 2400-2500MHZ 0404 |
| BD2425N50200AHF | XFRMR BALUN RF 2400-2500MHZ 0404 |
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