参数资料
| 型号： | BD12KA5FP-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 9/18页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.2V .5A TO252-3 |
| 标准包装： | 2,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.2V |
| 输入电压： | 2.3 V ~ 5.5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 500mA（最小值） |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-252-3，DPak（2 引线+接片），SC-63 |
| 供应商设备封装： | TO-252-3 |
| 包装： | 带卷 (TR) |
BDxxKA5 Series BDxxKA5W Series
● I/O equivalence circuit
BD00KA5W Series
Datasheet
Vcc
CTL
31.25k Ω 2k Ω
25k Ω
Vcc Vcc
R2
Vcc
OUT
ADJ
※
With BD00KA5WFP/WF,R1and R2 are connected
outside the IC between ADJ and GND and
between OUT and ADJ.
(BD00KA5WFP/WF)
R1
Fig.18
● Power Dissipation
Fig.19
2.0
TO252-5
2.0
TO252-3
Copper foil area ： 7 × 7 ｍｍ
Copper foil area ： 7 × 7 ｍｍ
1.6
1.30
Rohm standard board mounting
Board size ： 70 × 70 × 1.6 ｍｍ
2
θ ja=96.2( ℃ /W)
1.6
1.20
Rohm standard board mounting
Board size ： 70 × 70 × 1.6 ｍｍ
2
θ ja=104.2( ℃ /W)
1.2
1.2
0.8
0.4
0.8
0.4
0.0
0
25
50
75
100
125
150
0.0
0
25
50
75
100
125
150
1000
Ambient temperature：Ta(℃)
Fig.20 Power Dissipation heat
reducing characteristics
SOP8
(1)When using a standard board:
θ j-c=181.8( ℃ /W)
周 temperature
Ambient 囲温度：Ta(℃) )
Fig.21 Power Dissipation heat
reducing characteristics
800
(2) When using an IC alone
θ j-a=222.2( ℃ /W)
687.6mW
600
(1)
400
562.6mW
(2)
200
0
0
25
50 75 100 125
Ambient temperature ： Ta( ℃ )
150
周囲温度：Ta(℃)
Fig.22 Power Dissipation heat
reducing characteristics
When using at temperatures over Ta=25 ℃ , please refer to the power dissipation shown in Fig.20 through 22.
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the
maximum junction temperature Tj MAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures less than the maximum junction temperature Tj MAX.
Even when the ambient temperature Ta is a normal temperature (25 ℃ ), the chip(junction) temperature Tj may be quite high,
so please operate the IC at temperatures less than the acceptable loss Pd.
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
9/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BD12KA5WF | 制造商:ROHM 制造商全称:Rohm 功能描述:500mA Secondary LDO Regulators for Local Power Supplies |
| BD12KA5WF-E2 | 功能描述:低压差稳压器 - LDO 1.2V; 0.5A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| BD12KA5WFP | 制造商:ROHM 制造商全称:Rohm 功能描述:500mA Secondary LDO Regulators for Local Power Supplies |
| BD12KA5WFP-E2 | 功能描述:低压差稳压器 - LDO 1.2V; 0.5A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| BD12N | 制造商:Burndy 功能描述:BRAID |
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