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| 型号： | BD1603NUV-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 7/15页 |
| 文件大小： | 0K |
| 描述： | IC LED DRVR WHITE BCKLGT 10-VSON |
| 标准包装： | 1 |
| 拓扑： | PWM，切换式电容器（充电泵） |
| 输出数： | 1 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 背光 |
| 类型 - 次要： | 白色 LED |
| 频率： | 642kHz |
| 电源电压： | 2.7 V ~ 5.5 V |
| 输出电压： | 5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-VFDFN 裸露焊盘 |
| 供应商设备封装： | 10-VSON |
| 包装： | 标准包装 |
| 工作温度： | -30°C ~ 85°C |
| 产品目录页面： | 1371 (CN2011-ZH PDF) |
| 其它名称： | BD1603NUV-E2DKR |
BD1603NUV
● Description of Operations
1. ON/OFF Control
ON/OFF control takes place via the external EN pin.
EN = “H” : Operation
EN = “L” : Standby
Datasheet
2.
3.
4.
Low Ripple Charge Pump
BD1603NUV is equipped with a complementary charge pump circuit that achieves low ripple output.
Because BD1603NUV uses two pairs of charge switch and pump switch alternately, it can significantly reduce the
output ripple in comparison with the conventional double charge pumps.
Frequency Select
The operating frequency of a charge pump can be changed via the FSEL pin that is set to H or L.
This operating frequency must be selected considering the influence on other devices and according to the allowable
amount of ripple.
Efficiency
The efficiency can be obtained from the following formula:
η =
V OUT × Io
V IN × I IN
× 100 [ % ]
VOUT : Output voltage
I O
: Load current
V IN : Input voltage
I IN
: Input current
5.
6.
7.
Power Consumption
The power consumption can be obtained from the following formula:
P D = P IN － P OUT
= (V IN × I IN ) － (V O × I O ) [w]
V IN and I O must be set within an allowable loss of this LSI.
(You must set Io[mA] that it doesn't exceed Pd of this LSI.)
Because the allowable loss greatly depends on the PCB layout, the PCB layout must be designed considering heat dissipation.
In this PCB layout, the land pattern at the rear of this LSI must be directly connected to the ground plane.
Output Short-Circuit Current
When the output is short-circuited to the ground, outflow current is limited for LSI protection.
Once short-circuit is cleared, normal LSI operation is resumed (automatic return).
Thermal Shutdown
When the chip setting temperature is 185oC (typ) or more, the thermal shutdown function is activated to turn off the
charge pump circuit.
When this temperature falls below to the thermal detection temperature, normal LSI operation is resumed. Accordingly,
the following ON and OFF operations are repeated as thermal operations unless the primary cause is resolved.
Temperature
Thermal detection
Circuit OFF
Temperature drop
Circuit ON
Figure 13.Thermal Detection Loop
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
7/12
TSZ02201-0G3G0C200040-1-2
17.Dec.2012 Rev.001
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