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参数资料
| 型号： | BD1722N5050AHF |
| 厂商： | Anaren |
| 文件页数： | 4/5页 |
| 文件大小： | 3316K |
| 描述： | XFRMR BALUN RF 1700-2200MHZ 0404 |
| 标准包装： | 1 |
| 系列： | Xinger® |
| 频率范围： | 1700 ~ 2200MHz |
| 阻抗 - 不平衡/平衡： | 50 / 50 欧姆 |
| 相差： | 3.42° |
| 插入损耗（最大值）： | 1.02dB |
| 回程损耗（最小值）： | 12.5dB |
| 封装/外壳： | 4-SMD，无引线 |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 其它名称： | 1173-1060-6 |
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Model BD1722N5050AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
With No DC Bias
With DC Bias
.50
3x .29
.50
Plated thru
hole to
ground
.33
.22
.22
3x Transmission
Line
3x .29
Dimensions are in Millimeters
Mounting Footprint
Solder Resist
Footprint Pad (s)
Circuit Pattern
3x .29
3x .29
.50
.33
.33
.50
3x Transmission
Line
.22
.22
Plated thru
hole to
ground
Dimensions are in Millimeters
Mounting Footprint
Solder Resist
Footprint Pad (s)
Circuit Pattern
相关PDF资料 |
PDF描述 |
|---|---|
| BD2425N100ATI | XFRMR BALUN RF 2400-2500MHZ 0404 |
| BD2425N50100AHF | XFRMR BALUN RF 2400-2500MHZ 0404 |
| BD2425N50200AHF | XFRMR BALUN RF 2400-2500MHZ 0404 |
| BD2425N5050AHF | XFRMR BALUN RF 2400-2500MHZ 0404 |
| BD2425N50ATI | XFRMR BALUN RF 2400-2500MHZ 0404 |
相关代理商/技术参数 |
参数描述 |
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| BD175 | 制造商:TRSYS 制造商全称:Transys Electronics 功能描述:EPITAXIAL SILICON POWER TRANSISTORS |
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| BD17510STU | 功能描述:两极晶体管 - BJT NPN Epitaxial Sil RoHS:否 制造商:STMicroelectronics 配置: 晶体管极性:PNP 集电极—基极电压 VCBO: 集电极—发射极最大电压 VCEO:- 40 V 发射极 - 基极电压 VEBO:- 6 V 集电极—射极饱和电压: 最大直流电集电极电流: 增益带宽产品fT: 直流集电极/Base Gain hfe Min:100 A 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PowerFLAT 2 x 2 |
| BD175-16 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:TRANSISTOR | BJT | NPN | 45V V(BR)CEO | 3A I(C) | TO-126 |
| BD17516STU | 功能描述:两极晶体管 - BJT NPN Epitaxial Sil RoHS:否 制造商:STMicroelectronics 配置: 晶体管极性:PNP 集电极—基极电压 VCBO: 集电极—发射极最大电压 VCEO:- 40 V 发射极 - 基极电压 VEBO:- 6 V 集电极—射极饱和电压: 最大直流电集电极电流: 增益带宽产品fT: 直流集电极/Base Gain hfe Min:100 A 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PowerFLAT 2 x 2 |
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