参数资料
型号: BD2056AFJ-E2
厂商: Rohm Semiconductor
文件页数: 19/25页
文件大小: 0K
描述: IC SWITCH HIGH SIDE 2CH SOP-J8
特色产品: High Side Switch Regulators
标准包装: 1
类型: 高端
输入类型: 非反相
输出数: 2
导通状态电阻: 100 毫欧
电流 - 输出 / 通道: 250mA
电流 - 峰值输出: 500mA
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOP-J
包装: 标准包装
产品目录页面: 1371 (CN2011-ZH PDF)
其它名称: BD2056AFJ-E2DKR
BD2046AFJ
BD2056AFJ
Datasheet
(10) GND wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the
GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
(11) External Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
(12) Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature
of the IC reaches a specified value. Do not continue to operate the IC after this function is activated. Do not use the IC in
conditions where this function will always be activated.
(13) Thermal consideration
Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in
actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc ≥ Pd).
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax - Ta)/ θ ja
: Pc (W)=(Vcc - Vo)×Io+Vcc×Ib
Tjmax : Maximum junction temperature=150 ℃ , Ta : Peripheral temperature[ ℃ ] ,
θ ja : Thermal resistance of package-ambience[ ℃ /W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
www.rohm.com
? 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
19/22
TSZ02201-0E3E0H300140-1-2
11.Mar.2013 Rev.001
相关PDF资料
PDF描述
ACB60DHNR-S621 EDGECARD 120POS PCI32 .050 SLD
GCA10DCBN CONN EDGECARD 20POS R/A .125 SLD
W2L1YC473MAT1S CAP CER 0.047UF 16V 20% X7R 0508
ABB60DHNR-S621 EDGECARD 120POS PCI32 .050 SLD
GCA10DCBD CONN EDGECARD 20POS R/A .125 SLD
相关代理商/技术参数
参数描述
BD206 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:10 AMPERE POWER TRANSISTOR PNP SILICON
BD2061AFJ 制造商:ROHM 制造商全称:Rohm 功能描述:1ch Large Current Output USB High Side Switch ICs
BD2061AFJ_09 制造商:ROHM 制造商全称:Rohm 功能描述:1ch Large Current Output USB High Side Switch ICs
BD2061AFJ_11 制造商:ROHM 制造商全称:Rohm 功能描述:1ch High Side Switch ICs for USB Devices and Memory Cards
BD2061AFJ_13 制造商:ROHM 制造商全称:Rohm 功能描述:High Side Switch ICs