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参数资料
| 型号： | BD2425P50100AHF |
| 厂商： | Anaren |
| 文件页数： | 4/5页 |
| 文件大小： | 3429K |
| 描述： | XFRMR BALUN RF 2400-2500MHZ 0404 |
| 标准包装： | 1 |
| 系列： | Xinger® |
| 频率范围： | 2400 ~ 2500 MHz |
| 阻抗 - 不平衡/平衡： | 50 / 100 欧姆 |
| 相差： | 6° |
| 插入损耗（最大值）： | 0.9dB |
| 回程损耗（最小值）： | 19.0dB |
| 封装/外壳： | 4-SMD，无引线 |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 其它名称： | 1173-1068-6 |
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model BD2425P50100AHF
REV A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/
o
C.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.
With No DC Bias
With DC Bias
Plated thru
hole to
ground
Solder Resist
Footprint Pad (s)
Circuit Pattern
3X Transmission
Line
3X .011
[0.29]
3X .011
[0.29]
.020
[0.50]
.020
[0.50]
Dimensions are in Inches [Millimeters]
Mounting Footprint
.008 [0.21]
.008 [0.21]
.014 [0.36]
Plated thru
hole to
ground
Solder Resist
Footprint Pad (s)
Circuit Pattern
3X Transmission
Line
3X .011
[0.29]
3X .011
[0.29]
.020
[0.50]
.020
[0.50]
Dimensions are in Inches [Millimeters]
Mounting Footprint
.008 [0.21]
.008 [0.21]
.014 [0.36]
相关PDF资料 |
PDF描述 |
|---|---|
| BD3150N50100AHF | XFRMR BALUN RF 3100-5000MHZ 0404 |
| BD4859N50100AHF | XFRMR BALUN RF 4800-5900MHZ 0404 |
| BD4859N5050AHF | XFRMR BALUN RF 4800-5900MHZ 0404 |
| BICOLOG20100 | ANTENNA ISOTROPIC 20MHZ-1GHZ RAD |
| CA9-9-D | CABLE DB9M-DB9F |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BD2425P5075AHF | 制造商:Anaren Microwave 功能描述:BALUN TRANSFORMER |
| BD2-4281U | 制造商:Citizen Systems America Corporation 功能描述:Line Thermal Printer Mechanisms |
| BD242A | 功能描述:两极晶体管 - BJT 40W PNP Silicon RoHS:否 制造商:STMicroelectronics 配置: 晶体管极性:PNP 集电极—基极电压 VCBO: 集电极—发射极最大电压 VCEO:- 40 V 发射极 - 基极电压 VEBO:- 6 V 集电极—射极饱和电压: 最大直流电集电极电流: 增益带宽产品fT: 直流集电极/Base Gain hfe Min:100 A 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PowerFLAT 2 x 2 |
| BD242A-S | 功能描述:两极晶体管 - BJT 60V 3A PNP RoHS:否 制造商:STMicroelectronics 配置: 晶体管极性:PNP 集电极—基极电压 VCBO: 集电极—发射极最大电压 VCEO:- 40 V 发射极 - 基极电压 VEBO:- 6 V 集电极—射极饱和电压: 最大直流电集电极电流: 增益带宽产品fT: 直流集电极/Base Gain hfe Min:100 A 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PowerFLAT 2 x 2 |
| BD242ATU | 功能描述:两极晶体管 - BJT PNP Epitaxial Sil RoHS:否 制造商:STMicroelectronics 配置: 晶体管极性:PNP 集电极—基极电压 VCBO: 集电极—发射极最大电压 VCEO:- 40 V 发射极 - 基极电压 VEBO:- 6 V 集电极—射极饱和电压: 最大直流电集电极电流: 增益带宽产品fT: 直流集电极/Base Gain hfe Min:100 A 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PowerFLAT 2 x 2 |
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