参数资料
| 型号： | BD280-1927-25/16 |
| 厂商： | TE Connectivity |
| 文件页数： | 16/26页 |
| 文件大小： | 0K |
| 描述： | FUSE RESETTABLE BLADE 25A/14V |
| 产品培训模块： | Circuit Protection Products |
| 产品目录绘图： | BD280-1927 Series Side 1 BD280-1927 Series Side 2 |
| 特色产品： | PolySwitch BD280 Mini-terminal Bladed Device PolySwitch BD280 Mini-terminal Bladed Device |
| 标准包装： | 200 |
| 系列： | PolySwitch® |
| 电流 - 维持(Ih)： | 25A |
| 电流 - 跳闸(It)： | 32A |
| 电流 - 最大： | 100A |
| 电压 - 最大： | 16V |
| R最小/最大： | 0.003 ~ 0.004 欧姆 |
| 跳闸时间： | 13s |
| 封装/外壳： | 叶片类型 |
| 包装： | 散装 |
| 产品目录页面： | 2425 (CN2011-ZH PDF) |
| 其它名称： | BD280-1927-25 RF0103-000 |
Table A5 Physical Characteristics and Environmental Specifications for Automotive Devices
AGRF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
AGRF400 to AGRF1100 : Tin Plated Copper, 0.52mm 2 (20AWG) ? 0.8 mm/0.032in
AGRF1200 to AGRF1400 : Tin Plated Copper, 0.82mm 2 (18AWG) ? 1.0mm/0.040in
Solderability per ANSI/J-STD-002 Category 3
AGRF400: per IEC68-2-20 Test Tb, Method 1A, Condition A: can withstand 5 seconds at 260°C ± 5°C
AGRF500-AGRF1400: per IEC68-2-20 Test Tb, Method 1A, Condition B: can withstand 10 seconds at 260°C ± 5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
-40°C~85°C
Note: See PS400 for other physical characteristics.
Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85% RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
Note: See PS400 for other environmental specifications.
AHRF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
AHRF050 to AHRF200 : Tin-plated Copper Clad Steel, 0.205mm 2 (24 AWG), ? 0.51mm/0.020in
AHRF300 to AHRF1100 : Tin-plated copper 0.52mm 2 (20 AWG), ? 0.81mm/0.032 in
AHRF1300 to AHRF1500 : Tin-plated copper 0.82mm 2 (18 AWG), ? 1.0mm/0.04 in
Solderability per ANSI/J-STD 002 Category 3
per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ± 5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements
-40°C~125°C
Note: See PS400 for other physical characteristics.
Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85% RH, 1000 hours
125°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
12
Note: See PS400 for other environmental specifications.
AHEF
Physical Characteristics
Lead material
AHEF050 to AHEF100 : Tin-plated Copper Clad Steel, 0.205mm 2 (24 AWG), ? 0.51mm/0.020in.
AHEF300 to AHEF750 : Tin-plated Copper 0.52mm 2 (20 AWG), ? 0.81mm/0.032in
AHEF1000
: Tin-plated copper 0.82mm 2 (18 AWG), ? 1.0mm/0.04 in
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
Solderability per ANSI/J-STD 002 Category 3
per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ± 5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements
-40°C~125°C
Note: See PS400 for other physical characteristics.
Devices are not designed to be placed through a reflow process.
188
RoHS Compliant, ELV Compliant
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