参数资料
型号: BD4154FV-E2
厂商: Rohm Semiconductor
文件页数: 11/18页
文件大小: 0K
描述: IC POWER SWITCH SSOP-B20
标准包装: 2,500
应用: PCMCIA,ExpressCard?
电流 - 电源: 250µA
电源电压: 3 V ~ 3.6 V
工作温度: -40°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 20-SSOP-B
包装: 带卷 (TR)
BD4154FV
● Application Circuit (Circuit for ExpressCard TM Compliance Checklist)
Technical Note
CPPE#(1)
CPPE#(12pin)
RCLKEN(19pin)
CPUSB#(2)
3.3V(3)
CPUSB#(11pin)
V3(6,7pin)
V3_IN(4,5pin)
V3AUX_IN(18pin)
3.3V(7)
3.3Vaux(8)
BD4154FV
3.3Vaux(4)
1.5V(5)
PERST#(6)
V3AUX(17pin)
V15(13,14pin)
PERST#(8pin)
V15_IN(15,16pin)
PERST_IN#(1pin)
EN(2pin)
1.5V(9)
SysReset#(10)
SYSR(3pin)
GND(10pin)
● Heat loss
Thermal design should allow the device to operate within the following conditions. Note that the temperatures listed are the
allowed temperature limits. Thermal design should allow sufficient margin from these limits.
1. Ambient temperature Ta can be no higher than 100°C.
2. Chip junction temperature Tj can be no higher more than 150°C.
Chip junction temperature Tj can be determined as follows:
① Chip junction temperature Tj is calculated from IC surface temperature TC under actual application conditions:
Tj=TC+ θ j-cxW
< Reference value >
θ j-c:SSOP-B20 35 /W
② Chip junction temperature Tj is calculated from ambient temperature Ta:
Tj=TC+ θ j-axW
< Reference value >
θ j-a:SSOP-B20 250 ℃ /W (IC only)
153.8 ℃ /W Single-layer substrate
(substrate surface copper foil area: less than 3%)
Most of heat loss in the BD4154FV occurs at the output switch. The power lost is determined by multiplying the
on-resistance by the square of output current of each switch.
www.rohm.com
? 2010 ROHM Co., Ltd. All rights reserved.
11/15
2010.04 - Rev.B
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