参数资料
型号: BGF 117 E6328
厂商: Infineon Technologies
文件页数: 7/8页
文件大小: 0K
描述: IC FILTER/ESD PROT WLP-16-4
标准包装: 4,500
类型: 滤波器,HSMMC,带 ESD 保护
应用: HSMMC(高速多媒体卡)
安装类型: 表面贴装
封装/外壳: 16-WLP
供应商设备封装: S-WLP-16
包装: 带卷 (TR)
其它名称: SP000737100
BGF117
High-Speed Mini-/Micro-SD Card ESD Protection and EMI Filter
Data Sheet
7
V2.0, 2010-01-15
Application & signal routing
SD Card
contact spring
Top layer
Second layer
SD card
contacts face down
GND
DAT0
DAT1
CLK
Vcc
CMD
DAT3
DAT2
dat 2
dat 3
cmd
clk
dat 0
dat 1
Vcc
S
D
-H
o
st
BGF117
solder balls face down
Figure 4
Application example with signal routing
Pull-up resistors for the data and command lines are integrated in BGF117 (R7 to R11) to prevent bus floating in
case no card is inserted or all card drivers are in high impedance mode.
Package outline
Pin 1
Corner Index Area 2)
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
2) Pin 1 corner identified by marking
WLP-16-4-N-PO V01
0.2±0.05
STANDOFF
C
0.1
0.6±0.05
16x
COPLANARITY
0.08 C
SEA
TING
PLANE
C
3)
A1
A2
A3
B1
B2
B3
C1
C2
C3
A4
B4
C4
D1
D3
D2
D4
3 x 0.4 = 1.2
3
x
0.4
=
1.2
)
±0.05
1.55
B
±0.05
1.55
A
16x
1)
±0.04
0.25
0.05 M A B
0.4
±0.05
(0.175
)
±0.05
(0.175
)
±0.05
(0.175
)
±0.05
(0.175
Figure 5
Package outline for WLP-16-4 (dimensions in mm)
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