参数资料
| 型号： | BH2219FVM-TR |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 7/10页 |
| 文件大小： | 0K |
| 描述： | IC DAC 8BIT 2-CHAN MSOP8 |
| 标准包装： | 1 |
| 设置时间： | 100µs |
| 位数： | 8 |
| 数据接口： | 串行 |
| 转换器数目： | 2 |
| 电压电源： | 单电源 |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-VSSOP，8-MSOP（0.110"，2.80mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 标准包装 |
| 输出数目和类型： | 2 电压，单极 |
| 采样率（每秒）： | * |
| 其它名称： | BH2219FVM-DKR BH2219FVM-DKR-ND BH2219FVMDKR |
BH2219FVM, BH2220FVM
Technical Note
6/7
www.rohm.com
2009.06 - Rev.A
2009 ROHM Co., Ltd. All rights reserved.
●
Notes for use
(1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
(2) Although we are confident in recommending the sample application circuits, carefully check their characteristics further
when using them. When modifying externally attached component constants before use, determine them so that they
have sufficient margins by taking into account variations in externally attached components and the Rohm LSI, not only
for static characteristics but also including transient characteristics.
(3) Absolute maximum ratings
Operating or testing the device over the maximum specifications may damage the part itself as well as peripheral components.
Therefore, please ensure that the specifications are not exceeded.
(4) GND potential
Ensure that the GND terminal is at the lowest potential under all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin regarding power dissipation (Pd) under actual operating conditions.
(6) Terminal shorts and mis-mounting
Incorrect orientation or misalignment of the IC when mounting to the PCB may damage part. Short-circuits caused by the
introduction of foreign matter between the output terminals or across the output and power supply or GND may also
result in destruction.
(7) Operation in a strong magnetic field
Operation in a strong electromagnetic field may cause malfunction.
(8) Reset circuit
The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons.
Therefore, set the time constant so as to satisfy the power source rise time.
●
Thermal Derating Curve
·
MSOP8
Board size: 70 x 70 x 1.6mm Material : FR4 glass epoxy board (copper foil area less than 3%)
Fig.18
0
100
200
300
400
500
0
25
50
75
100
125
Ta [℃]
PD
[mW]
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相关代理商/技术参数 |
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| BH2220FVM-TR | 功能描述:数模转换器- DAC IC D/A 8BIT 3CH RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| BH2220GLS-E2 | 功能描述:数模转换器- DAC TUNING D/A CONVERTER RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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