参数资料
型号: BK0603HS330-T
厂商: Taiyo Yuden
文件页数: 33/36页
文件大小: 0K
描述: FERRITE BEAD 33 OHM 0201
产品培训模块: EMC Applications
产品目录绘图: (BK,BKP)0603 Series
标准包装: 1
系列: BK
频率对应阻抗: 33 欧姆 @ 100MHz
额定电流: 500mA
DC 电阻(DCR): 最大 70 毫欧
滤波器类型: 差模 - 单线
封装/外壳: 0201(0603 公制)
安装类型: 表面贴装
包装: 标准包装
高度(最大): 0.013"(0.33mm)
尺寸/尺寸: 0.024" L x 0.012" W(0.60mm x 0.30mm)
产品目录页面: 1854 (CN2011-ZH PDF)
其它名称: 587-1828-6
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
c
d
c
Recommended land dimension for Reflow-soldering
Type
3216
2010
1210
0806
0605
Size
L 3.2 2.0 1.25 0.85 0.65
W 1.6 1.0 1.0 0.65 0.50
a 0.7~0.9 0.5~0.6
0.45~0.55 0.25~0.35 0.27~0.33
d
b 0.8~1.0
0.5~0.6
0.7~0.8
0.25~0.35 0.17~0.23
((2) Examples of good and bad solder application
c 0.4~0.5
d 0.8
(Unit:mm)
0.2~0.3
0.5
0.25~0.35 0.25~0.35 0.20~0.26
0.55 0.5 0.4
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Component placement close to
the chassis
Solder (for grounding)
Electrode pattern
Lead wire of component
Solder-resist
Hand-soldering of leaded
Soldering iron
Solder-resist
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations(Inductor layout on panelized[ breakaway] PC boards)
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Deflection of the board
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
Slit
B
Magnitude of stress
A>B=C>D>E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E02R01
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