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参数资料
| 型号： | BK20104L100-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 28/31页 |
| 文件大小： | 0K |
| 描述： | FERRITE BEAD 10 OHM 0804 |
| 标准包装： | 1 |
| 系列： | BK |
| 频率对应阻抗： | 10 欧姆 @ 100MHz |
| 额定电流： | 100mA |
| DC 电阻(DCR)： | 最大 150 毫欧 |
| 滤波器类型： | 差模 - 4 线阵列 |
| 封装/外壳： | 0804（2010 公制），阵列，8 PC 板 |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 高度（最大）： | 0.020"（0.50mm） |
| 尺寸/尺寸： | 0.079" L x 0.039" W（2.00mm x 1.00mm） |
| 其它名称： | 587-2674-6 |
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Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when
designing land-patterns.
c
d
c
Recommended land dimension for Reflow-soldering
Type
3216
2010
1210
0806
0605
Size
L 3.2 2.0 1.25 0.85 0.65
W 1.6 1.0 1.0 0.65 0.50
a 0.7～0.9 0.5～0.6
0.45～0.55 0.25～0.35 0.27～0.33
d
b 0.8～1.0
0.5～0.6
0.7～0.8
0.25～0.35 0.17～0.23
（（2） Examples of good and bad solder application
c 0.4～0.5
d 0.8
（Unit：mm）
0.2～0.3
0.5
0.25～0.35 0.25～0.35 0.20～0.26
0.55 0.5 0.4
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Component placement close to
the chassis
Solder (for grounding)
Electrode pattern
Lead wire of component
Solder-resist
Hand-soldering of leaded
Soldering iron
Solder-resist
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Deflection of the board
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
Slit
B
Magnitude of stress
A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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相关代理商/技术参数 |
参数描述 |
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| BK20104L121-T | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 FER BD MULTILYR CHIP 0804 120OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BK20104L181-T | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 FER BD MULTILYR CHIP 0804 180OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BK20104L220-T | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 FER BD MULTILYR CHIP 0804 22OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BK20104L330-T | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 FER BD MULTILYR CHIP 0804 33OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BK20104L470-T | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 FER BD MULTILYR CHIP 0804 47OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
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