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参数资料
| 型号： | BKP1608HS181-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 27/31页 |
| 文件大小： | 0K |
| 描述： | FERRITE BEAD 180 OHM 0603 |
| 产品培训模块： | EMC Applications |
| 产品目录绘图： | (BK,BKP)1608 Series |
| 标准包装： | 1 |
| 系列： | BKP |
| 频率对应阻抗： | 180 欧姆 @ 100MHz |
| 额定电流： | 1.5A |
| DC 电阻(DCR)： | 最大 75 毫欧 |
| 滤波器类型： | 差模 - 单线 |
| 封装/外壳： | 0603（1608 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 高度（最大）： | 0.037"（0.95mm） |
| 尺寸/尺寸： | 0.063" L x 0.031" W（1.60mm x 0.80mm） |
| 产品目录页面： | 1854 (CN2011-ZH PDF) |
| 其它名称： | 587-1924-6 |
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Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■ PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
Precautions
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
Precautions
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
C
Chip inductor
Solder-resist
Chip inductor
W
B
A
B
L
Recommended land dimensions for wave-soldering
（Unit：mm）
Type
1608
2012
2125
2016
2520
3216
Technical
considerations
Size
L 1.6 2.0 2.0
W 0.8 1.25 1.25
A 0.8～1.0 1.0～1.4 1.0～1.4
B 0.5～0.8 0.8～1.5 0.8～1.5
C 0.6～0.8 0.9～1.2 0.9～1.2
2.0 2.5
1.6 2.0
1.0～1.4 1.0～1.4
0.8～1.5 0.6～1.0
1.3～1.6 1.6～2.0
3.2
1.6
1.8～2.5
0.8～1.7
1.2～1.6
Recommended land dimensions for reflow-soldering
（Unit：mm）
Type
0402
0603
1005
105
1608
2012
Size
L 0.4 0.6 1.0
W 0.2 0.3 0.5
A 0.15～0.25 0.20～0.30 0.45～0.55
B 0.10～0.20 0.20～0.30 0.40～0.50
C 0.15～0.30 0.25～0.40 0.45～0.55
1.0
0.6
0.50～0.55
0.30～0.40
0.60～0.70
1.6
0.8
0.8～1.0
0.6～0.8
0.6～0.8
2.0
1.25
0.8～1.2
0.8～1.2
0.9～1.6
Type
2125
2016
2520
3216
Size
A
B
C
L
W
2.0
1.25
0.8～1.2
0.8～1.2
0.9～1.6
2.0
1.6
0.8～1.2
0.8～1.2
1.2～2.0
2.5
2.0
1.0～1.4
0.6～1.0
1.8～2.2
3.2
1.6
1.8～2.5
0.6～1.5
1.2～2.0
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BKP1608HS181-T | 制造商:TAIYO YUDEN 功能描述:MULTILAYER FERRITE BEAD |
| BKP1608HS181TK | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 180ohms 1500mA RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BKP1608HS181-TV | 功能描述:180 Ohm Impedance Ferrite Bead 0603 (1608 Metric) Surface Mount Power Line 1.5A 1 Lines 75 mOhm Max DCR -55°C ~ 125°C 制造商:taiyo yuden 系列:BK 包装:剪切带（CT） 零件状态:有效 滤波器类型:电源线 线路数:1 不同频率时的阻抗:180 欧姆 @ 100MHz 额定电流（最大）:1.5A 直流电阻（DCR）（最大）:75 毫欧 等级:AEC-Q200 工作温度:-55°C ~ 125°C 封装/外壳:0603（1608 公制） 安装类型:表面贴装 高度（最大值）:0.037"（0.95mm） 大小/尺寸:0.063" 长 x 0.031" 宽（1.60mm x 0.80mm） 标准包装:1 |
| BKP1608HS271-T | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 FER BD HI CUR LW RDC 0603 270OHMS 25% RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BKP1608HS271TK | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 270ohms 1200mA RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
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