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参数资料
| 型号： | BLM41PG102SN1D |
| 厂商： | MURATA MANUFACTURING CO LTD |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, 1.5 A, FERRITE CHIP |
| 封装： | EIA STD PACKAGE SIZE 1806 |
| 文件页数： | 8/9页 |
| 文件大小： | 196K |
| 代理商： | BLM41PG102SN1D |
This is the PDF file of catalog No.C31E-6
C31E6.pdf 01.5.29
2
Continued from the preceding page.
Continued on the following page.
(1) Solder Paste Printing
BLM Series
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100
m to 200m.
(2) Adhesive Application
BLM Series
o Coating amount is illustrated in the following diagram.
(1) SOLDERING METHODS
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
EMI suppression filters.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
o Ensure that solder is applied smoothly to a minimum
height of 0.2mm to 0.3mm at the end surface of the
part.
o Coat the solder paste a thickness of 100
m to 200m.
(2) SOLDERING TEMPERATURE AND TIME
To prevent external electrode solder leaching and
performance deterioration, solder within the temperature
and time combinations illustrated by the slanted lines in
the following graphs. If soldering is repeated, please note
that the allowed time is the accumulated time.
Solder : H60A H63A solder(JIS Z 3238)
Flux :
o Use Rosin-based fulx(when using RA type solder, clean
products sufficiently to avoid residual fulx.
o Do not use strong acidic fulx(with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble fulx.
3. Standard Soldering Conditions
0
.2
0
.3
m
in
a:20
m70m
b:30
m35m
c:50
m105m
c
a
b
Chip Solid Inductor
Bonding agent
Land
PCB
270
280
260
250
240
230
0
5
10
15
20
25
30
Time [s]
T
e
m
p
e
ra
tu
re
[°
C
]
270
280
260
250
240
230
0
20
30
40
50
60
70
80
90
T
e
m
p
e
ra
tu
re
[°
C
]
BLM
Allowable Flow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
BLM
(Except for BLM15)
BLM Series Notice (Soldering and Mounting)
61
2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BLM41PG102SN1J | 制造商:MURATA 制造商全称:Murata Manufacturing Co., Ltd. 功能描述:EMIFIL (Inductor type) Chip Ferrite Bead BLM41P Series (1806 Size) |
| BLM41PG102SN1K | 制造商:MURATA 制造商全称:Murata Manufacturing Co., Ltd. 功能描述:EMIFIL (Inductor type) Chip Ferrite Bead BLM41P Series (1806 Size) |
| BLM41PG102SN1L | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 1806 1K OHM RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BLM41PG181SH1L | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 1806 180ohms Power Supply Tape RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| BLM41PG181SN1 | 制造商:MURATA 制造商全称:Murata Manufacturing Co., Ltd. 功能描述:On-Board Type (DC) EMI Suppression Filters |
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