型号: | BM10B-ZESS-TBT(LF)(SN) |
厂商: | J S T MFG CO LTD |
元件分类: | 电路板相叠连接器 |
英文描述: | 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
封装: | ROHS COMPLIANT |
文件页数: | 3/4页 |
文件大小: | 200K |
代理商: | BM10B-ZESS-TBT(LF)(SN) |
相关PDF资料 |
PDF描述 |
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BM10B-ZESS-TBT | 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
BM11B-ZESS-TBT(LF)(SN) | 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
BM11B-ZESS-TBT | 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
BM12B-ZESS-TBT(LF)(SN) | 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
BM12B-ZESS-TBT | 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT |
相关代理商/技术参数 |
参数描述 |
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BM10B-ZPDSS-TF(LF)(SN) | 制造商:JST Manufacturing 功能描述:CONN HEADER SMD 10POS ZPD 制造商:JST Manufacturing 功能描述:10 Position 1.50 mm SMT Shrouded Header |
BM-10EG57ND | 制造商:BRIGHT 制造商全称:BRIGHT LED ELECTRONICS CORP 功能描述:hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate. |
BM-10EG58MD | 制造商:BRIGHT 制造商全称:BRIGHT LED ELECTRONICS CORP 功能描述:hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate. |
BM-10EG58ND | 制造商:BRIGHT 制造商全称:BRIGHT LED ELECTRONICS CORP 功能描述:LED DOT MATRIX DISPLAY |
BM-10EG88MD | 制造商:BRIGHT 制造商全称:BRIGHT LED ELECTRONICS CORP 功能描述:hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate. |