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参数资料
| 型号： | BQ2002ESN |
| 厂商： | Texas Instruments |
| 文件页数： | 11/15页 |
| 文件大小： | 0K |
| 描述： | IC CONTROLLER FASTCHRGE 8-SOIC |
| 标准包装： | 75 |
| 功能： | 充电管理 |
| 电池化学： | 镍镉（NiCd）、镍金属氢化物（NiMH） |
| 电源电压： | 4 V ~ 6 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 1016 (CN2011-ZH PDF) |
| 配用： | 296-9488-ND - EVAL MOD FOR BQ2002 |
| 其它名称： | 296-9321-5 |
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
7-May-2007
Orderable Device
Status (1)
Package
Package
Pins Package Eco Plan (2)
Lead/Ball Finish
MSL Peak Temp (3)
Type
Drawing
Qty
BQ2002EPN
ACTIVE
PDIP
P
8
50
Pb-Free
CU NIPDAU
N / A for Pkg Type
(RoHS)
BQ2002EPNE4
ACTIVE
PDIP
P
8
50
Pb-Free
CU NIPDAU
N / A for Pkg Type
(RoHS)
BQ2002ESN
ACTIVE
SOIC
D
8
75
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
BQ2002ESNG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
BQ2002ESNTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
BQ2002ESNTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
BQ2002GPN
ACTIVE
PDIP
P
8
50
Pb-Free
CU NIPDAU
N / A for Pkg Type
(RoHS)
BQ2002GPNE4
ACTIVE
PDIP
P
8
50
Pb-Free
CU NIPDAU
N / A for Pkg Type
(RoHS)
BQ2002GSN
ACTIVE
SOIC
D
8
75
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
BQ2002GSNG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
BQ2002GSNTR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
BQ2002GSNTRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
CU NIPDAU
Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BQ2002ESN | 制造商:Texas Instruments 功能描述:Battery Management IC |
| BQ2002ESNG4 | 功能描述:电池管理 NiCd/NiMH Gating Charge Mngmnt IC RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| BQ2002ESNTR | 功能描述:电池管理 NiCd/NiMH Gating Charge Mngmnt IC RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| BQ2002ESNTRG4 | 功能描述:电池管理 NiCd/NiMH Charge Controller RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| BQ2002F | 制造商:TI 制造商全称:Texas Instruments 功能描述:NiCd/NiMH Fast-Charge Management ICs |
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