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参数资料
| 型号： | BRL2012T3R3M |
| 厂商： | Taiyo Yuden |
| 文件页数： | 12/12页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR 3.3UH 20% 0805 SMD |
| 标准包装： | 1 |
| 系列： | BR |
| 电感： | 3.3µH |
| 电流： | 440mA |
| 电流 - 饱和： | 490mA |
| 电流 - 温升： | 440mA |
| 容差： | ±20% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 650 毫欧 |
| 频率 - 自谐振： | 190MHz |
| 封装/外壳： | 0805（2012 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 105°C |
| 频率 - 测试： | 7.96MHz |
| 其它名称： | 587-3023-6 |
6. Handling
◆Handling
1. Keep the product away from any magnets.
◆Cutting the PC boards
1. Please don't give any stress of the bending or the twisting for the cutting process of PC boards.
2. Please don't give any shock and stress to the products in transportation.
Precautions
Technical
considerations
◆Mechanical considerations
1. Please don't give too much shock to the product.
2. Please don't give any shock and stress to the products in transportation.
◆The stress for picking and placing
1. Please don't give any shock into an exposed ferrite core.
◆Packing
1. Please don't pile the packing boxes up as much as possible.
◆Handling
1. There is a case that a characteristic varies with magnetic influence.
◆Cutting the PC boards
1. Please don't give the bending stress or the twisting stress to the products because they might break in such cases.
◆Mechanical considerations
1. The mechanical shock might break the products.
2. The products might break depending on the handling in transportation.
◆Pick-up pressure
1. The electrical characteristics of the products might be shifted by too much physical shock and stress.
◆Packing
1. The products and the tape might break, if the packing boxes are piled up.
7. Storage conditions
◆Storage
1. The packing boxes can be kept at the ambient which the temperature is from 0 to 40degC and the humidity is less than 70%.
Precautions
Technical
considerations
2. The ambient temperature of less than 30degC is recommended not to get the tape and the solderability worse.
3. Please solder the products by a half year after they have been shipped.
Otherwise please use them after checking the solderability in advance.
◆Storage
1. The ambient of high temperature or high humidity might accelerate to make the solderability and the tape worse.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_BR_prec_e-E02R01
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