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参数资料
| 型号： | BRL2012T470M |
| 厂商： | Taiyo Yuden |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR 47UH 125MA 20% SMD |
| 产品培训模块： | SMD Power Inductors EMC Applications |
| 产品目录绘图： | BRL2012 Series End BRL2012 Series Side |
| 标准包装： | 1 |
| 系列： | BR |
| 电感： | 47µH |
| 电流： | 160mA |
| 电流 - 饱和： | 125mA |
| 电流 - 温升： | 160mA |
| 容差： | ±20% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 4.55 欧姆 |
| 频率 - 自谐振： | 7MHz |
| 封装/外壳： | 0805（2012 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 105°C |
| 频率 - 测试： | 2.52MHz |
| 产品目录页面： | 1824 (CN2011-ZH PDF) |
| 其它名称： | 587-2068-6 |
Wound Chip power inductor （BR-series）
■ PRECAUTIONS
1. Circuit Design
◆Operating Ambient
The products are premised on the usage for the general equipments like the office supply equipment, the telecommunications systems, the
Precautions
measuring equipment, the household equipment and so on.
Please ask to TAIYO YUDEN's sales person in advance, if you need to apply them to the equipments or the systems which might have any
influences for the human body, the property, like the traffic systems, the safety equipment, the aerospace systems, the nuclear control
systems, the medical equipment and soon.
2. PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please refer to a recommended land pattern.
◆Land pattern design
Surface Mounting
1. The conditions of the picking and placing should be checked in advance.
2. The products are only for reflow soldering.
3. Considerations for automatic placement
◆Adjustment of mounting machine
Precautions
Technical
considerations
1. Excessive physical impact should not be imposed on the products for picking and placing onto the PC boards.
2. Mounting and soldering conditions should be checked in advance.
◆Adjustment of mounting machine
The products might be broken if too much stress is given for the picking and placing.
4. Soldering
◆Reflow soldering
1. Please apply our recommended soldering conditions on the specification as much as possible.
2. The products are only for reflow soldering.
3. Please do not give any stress to a product until it returns in room temperature after reflow soldering.
◆Lead free soldering
Precautions
1. Please check the adhesion, the solder temperature, the solderability and the shape of solder filet if the solder that is not in the
specification is used.
◆Recommended conditions for using a soldering iron (NR10050 Type)
Touch a soldering iron to the land pattern not to the product directly.
The temperature of a soldering iron is less than 350degC.
The soldering is for 3 seconds or less.
◆Reflow soldering
1. The product might break or might make the tombstoning, if the soldering conditions are too far from our recommended conditions.
Technical
considerations
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. Please don't wash by the ultra-sonic waves.
◆Cleaning conditions
1. Washing by the ultra-sonic waves might break the product.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_BR_prec_e-E02R01
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