参数资料
型号: BU-63825D1-201
厂商: DATA DEVICE CORP
元件分类: 微控制器/微处理器
英文描述: 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
封装: CERAMIC, DIP-70
文件页数: 45/48页
文件大小: 405K
代理商: BU-63825D1-201
6
Data Device Corporation
www.ddc-web.com
BU-63825
C-02/06-0
TABLE 2. SP’ACE II SERIES RADIATION
SPECIFICATIONS*
PART
NUMBER
TOTAL
DOSE
SINGLE EVENT
UPSET
SINGLE EVENT
LATCHUP
BU-63825(925)X0
BU-63825(925)X1
BU-63825(925)X2
1 x 106
Rad
2.56 x 10-5
errors/device-day,
(LET Threshold of
63 MeV-cm2/mg)
Immune
QCI TESTING
MIL-STD-883, Method 1018
MIL-STD-883, Method 1010 Condition C
and MIL-STD-883, Method 2012
MIL-STD-883, Method 2012
MIL-STD-883, Method 2023
MIL-STD-883, Method 1015
MIL-STD-883, Method 2020 Condition A
MIL-PRF-38534
MIL-STD-883, Method 2018
MIL-STD-883, Method 2010 Condition A
MIL-STD-750, Method 2072 and 2073
MIL-STD-883, Method 2032 Class S
METHOD
Moisture Content Limit of
5000 PPM
Extended Temperature
Cycling:
20 Cycles Including
Radiographic (X-Ray)
Testing
Radiographic (X-Ray)
Analysis
100% Non-Destructive
Wirebond Pull
(standard on this device)
320-Hour Burn-In
(standard on this device)
Particle Impact Noise
Detection (PIND)
Element Evaluation:
Visual,
Electrical,
Wire Bondability,
24-Hour Stabilization Bake,
10 Temperature Cycles
5000 g’s constant acceleration
240-Hour Powered Burn-In
and 1000-Hour Life Test
(Burn-In and 1000-Hour Life
Test Are Only Required For
Active Components.)
SEM Analysis for Integrated
Circuits
Visual Inspection:
Integrated Circuits
Transistors & Diodes
Passive Components
ASSEMBLY & TEST
ELEMENT EVALUATION
TABLE 3. HIGH RELIABILITY SCREENING OPTIONS
BU-63825(925)X3
BU-63825(925)X6
100 KRad
2.56 x 10-5
errors/device-day,
(LET Threshold of
63 MeV-cm2/mg)
Immune
RADIATION TOLERANCE
The BU-63825 combines analog bipolar/BiCMOS transceivers
with logic and RAM fabricated to provide radiation survivability.
To summarize,
BU-63825(925)X0, X1, X2 has a total gamma dose immunity
of 1x106 Rad and a LET threshold of 63 MeV-cm2/mg, provid-
ing a soft error rate of 2.56 x 10-5 errors/device-day.
BU-63825(925)X3, X6 has a total gamma dose immunity of
100-K Rad and a LET threshold of 63 MeV-cm2/mg, providing a
soft error rate of 2.56 x 10-5 errors/device-day.
The hybrids are inherently immune to Latchup. The transceiver
is bipolar/BiCMOS, the digital logic is implemented in a
Honeywell RICMOS IV SOI Gate Array (HX2000 Series) and
the RAM is implemented utilizing a radiation-hardened process
(Honeywell HX6256).
HIGH-REL SCREENING
DDC is committed to the design and manufacture of hybrids and
transformers with enhanced processing and screening for
spaceborne applications and other systems requiring the highest
levels of reliability. These platforms include launch vehicles,
satellites and the International Space Station.
DDC has tailored its design methodologies to optimize the fabri-
cation of space level hybrids. The intent of the design guidelines
is to minimize the number of die and wirebonds, minimize the
number of substrate layers, and maximize the space between
components. DDC’s space grade products combine analog bipo-
lar/BiCMOS and radiation hardened Honeywell RICMOS IV
SOI Gate Array (HX2000 Series) technology to provide various
levels of radiation tolerance.
The BU-63825 is packaged in a 70-pin ceramic package. In con-
trast to Kovar (metal) packages, the use of ceramic eliminates
the hermeticity problems associated with the glass beads used
in the metal packages. In addition, ceramic packages provide
more rigid leads, better thermal properties, easier wirebonding,
and lower weight.
The production of the space level hybrids can entail enhanced
screening steps beyond DDC’s standard flow. This includes
Condition A visual inspection, SEM analysis, and element evalu-
ation for all integrated circuit die. For the hybrids, additional
screening includes Particle Impact Noise Detection (PIND), 320-
*Note: Radiation parameters specified on this data sheet are derived from initial
qualification testing by
DDC and published data from ASIC manufacturers. These
devices have not been evaluated for compliance to the
RHA requirements stipulat-
ed in MIL-PRF-38534,
Appendix G.
相关PDF资料
PDF描述
BU-63825D2-190 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-63825D2-200 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-63825D2-300 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-63825D6-191 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
BU-63825D6-301 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQIP70
相关代理商/技术参数
参数描述
BU-63-9 功能描述:测试电夹 White Insul Alligato RoHS:否 制造商:Pomona Electronics 类型:Minigrabber clip 颜色:Black
BU-63C-0 功能描述:测试电夹 Black Insul Alligato RoHS:否 制造商:Pomona Electronics 类型:Minigrabber clip 颜色:Black
BU-63C-2 功能描述:测试电夹 Red Insul Alligator RoHS:否 制造商:Pomona Electronics 类型:Minigrabber clip 颜色:Black
BU-63C-4 功能描述:测试电夹 Yellow Insul Alligat RoHS:否 制造商:Pomona Electronics 类型:Minigrabber clip 颜色:Black
BU-63C-5 功能描述:测试电夹 Green Insul Alligato RoHS:否 制造商:Pomona Electronics 类型:Minigrabber clip 颜色:Black