参数资料
| 型号： | BU12TD2WNVX-TL |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 38/43页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.2V .2A 4-SSON |
| 标准包装： | 5,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.2V |
| 输入电压： | 1.7 V ~ 5.5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA（最小） |
| 电流 - 限制（最小）： | 220mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-UDFN 裸露焊盘 |
| 供应商设备封装： | * |
| 包装： | 带卷 (TR) |
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BUxxTD2WNVX series
Datasheet
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Layout of Board for
Measurement
IC
Implementation
Position
Standard ROHM Board
Top Layer (Top View)
Bottom Layer (Top View)
Evaluation Board 1
Top Layer (Top View)
Bottom Layer (Top View)
Measurement State
Board Material
Board Size
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Double-side board)
70 mm x 70 mm x 1.6 mm
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Double-side board)
40 mm x 40 mm x 1.6 mm
Wiring
Rate
Top layer
Bottom
layer
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Metal (GND) wiring rate: Approx. 50%
Metal (GND) wiring rate: Approx. 50%
Through Hole
Power Dissipation
Thermal Resistance
0.6
0.56W
0.5
0.4
0.39W
0.3
0.2
0.1
0
Diameter 0.5mm x 6 holes
0.56W
θ ja=178.6°C/W
Diameter 0.5mm x 25 holes
0.39W
θ ja=256.4°C/W
* Please design the margin so that
PMAX becomes is than Pd (PMAX < Pd)
within the usage temperature range
0
25
50
75
85
100
125
Ta [ ℃ ]
Fig. 285 SSON004X1010
Power dissipation heat reduction characteristics (Reference)
www.rohm.com ? 2013 ROHM Co., Ltd. All rights reserved.
TSZ02201-0RBR0A300050-1-2
TSZ22111 ? 15 ? 001
38/40
14.Jan.2013.Rev.008
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| BU12TD3WG-TR | 功能描述:低压差稳压器 - LDO Standard CMOS LDO Vreg; 1.2V RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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