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参数资料
| 型号： | BU31TA2WNVX-TR |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 24/30页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.1V .2A 4-SSON |
| 特色产品： | CMOS LDO Regulators |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.1V |
| 输入电压： | 最高 5.5V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA（最小值） |
| 电流 - 限制（最小）： | 250mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-UDFN 裸露焊盘 |
| 供应商设备封装： | 4-SSON-EP（1.2x1.6） |
| 包装： | 标准包装 |
| 其它名称： | BU31TA2WNVX-DKR BU31TA2WNVX-DKR-ND BU31TA2WNVXDKR |
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BU ?? TA2WNVX series, BU ?? TA2WHFV series
Technical Note
● About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (P MAX )
P MAX =(V IN -V OUT )×I OUT (MAX.) (V IN : Input voltage V OUT : Output voltage
Measurement conditions
Evaluation Board 1
(Single-side Board)
40
20
40 20
Layout of Board for
Measurement
(Unit: mm)
Top Layer (Top View)
40
IC Implementation Position
40
Bottom Layer (Top View)
I OUT (MAX): Maximum output current)
Evaluation Board 2
(Double-side Board)
40
20
40 20
Top Layer (Top View)
40
20
40 20
Bottom Layer (Top View)
Measurement State
Board Material
Board Size
Top layer
Wiring Rate
Bottom layer
Through Hole
Power Dissipation
Thermal Resistance
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Single-side board)
40 mm x 40 mm x 0.8 mm
Metal (GND) wiring rate: Approx. 25%
Metal (GND) wiring rate: Approx 0%
0 holes
1100 mW
θ ja=91 ℃ /W
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Double-side board)
40 mm x 40 mm x 0.8 mm
Metal (GND) wiring rate: Approx. 25%
Metal (GND) wiring rate: Approx 25%
Diameter 0.5 mm ? 12 holes
1250 mW
θ ja=80 ℃ /W
www.rohm.com
? 2011 ROHM Co., Ltd. All rights reserved.
24/29
2011.01 - Rev.C
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| BU31UA3WNVX-TL | 制造商:ROHM 制造商全称:Rohm 功能描述:Versatile Package FULL CMOS LDO Regulator |
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