参数资料
型号: BU4S71G2-TR
厂商: Rohm Semiconductor
文件页数: 5/14页
文件大小: 0K
描述: IC GATE OR SINGLE 5SSOP
标准包装: 3,000
系列: 4S
逻辑类型: 或门
电路数: 1
输入数: 2
电源电压: 3 V ~ 16 V
电流 - 静态(最大值): 1µA
输出电流高,低: 3.4mA,3.4mA
逻辑电平 - 低: 1.5 V ~ 4 V
逻辑电平 - 高: 3.5 V ~ 11 V
额定电压和最大 CL 时的最大传播延迟: 30ns @ 15V,50pF
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
供应商设备封装: 5-SSOP
封装/外壳: 6-TFSOP(0.063",1.60mm 宽),5 引线
包装: 带卷 (TR)
2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAB1200 Rev 1.2.7
15
FAB
12
00
Ground
-Re
ferenc
ed
Class
-G
He
adp
hone
Ampli
fi
er
wi
th
I
n
tegrated
Buck
Co
nvert
er
Physical Dimensions
Figure 23. 16-Ball WLCSP, 4x4 Array, 0.4 mm Pitch, 250 m Ball
Product-Specific Dimensions
Product
D
E
X
Y
FAB1200UCX
1.56 mm
0.18 mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent version.
Package specifications do not expand Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel
BOTTOM VIEW
SIDE VIEWS
TOP VIEW
RECOMMENDED LAND PATTERN
BALL A1
INDEX AREA
1 2 3 4
A
B
C
D
SEATING
PLANE
16X
A1
0.005
C A B
F
(NSMD PAD TYPE)
0.260±0.02
0.40
(X) ±0.018
(Y) ±0.018
0.625
0.547
0.06 C
0.05 C
E
D
F
0.378±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC016AArev2.
0.03 C
2X
0.03 C
2X
E
D
B
C
A
0.40
(0.20)
Cu Pad
(0.30) Solder
Mask Opening
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