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| 型号： | BUF08821AIPWPR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 时钟产生/分配 |
| 英文描述： | VIDEO CLOCK GENERATOR, PDSO20 |
| 封装： | GREEN, PLASTIC, HTSSOP-20 |
| 文件页数： | 10/27页 |
| 文件大小： | 654K |
| 代理商： | BUF08821AIPWPR |
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SBOS438C – AUGUST 2008 – REVISED AUGUST 2009 ................................................................................................................................................. www.ti.com
GENERAL POWERPAD DESIGN
example thermal land pattern mechanical drawing
CONSIDERATIONS
is attached to the end of this data sheet.
3. Additional vias may be placed anywhere along
The BUF08821 is available in a thermally-enhanced
the thermal plane outside of the thermal pad area
PowerPAD package. This package is constructed
to help dissipate the heat generated by the
using a downset leadframe upon which the die is
BUF08821 IC. These additional vias may be
mounted; see Figure 19(a) and Figure 19(b). This
larger than the 13-mil diameter vias directly under
arrangement results in the lead frame being exposed
the thermal pad. They can be larger because
as a thermal pad on the underside of the package;
they are not in the thermal pad area to be
see Figure 19(c). This thermal pad has direct thermal
soldered; thus, wicking is not a problem.
contact
with
the
die;
thus,
excellent
thermal
performance is achieved by providing a good thermal
4. Connect all holes to the internal plane that is at
path away from the thermal pad.
the same voltage potential as the GND pins.
5. When connecting these holes to the internal
The PowerPAD package allows for both assembly
plane, do not use the typical web or spoke via
and thermal management in one manufacturing
connection methodology. Web connections have
operation. During the surface-mount solder operation
a high thermal resistance connection that is
(when the leads are being soldered), the thermal pad
useful for slowing the heat transfer during
must be soldered to a copper area underneath the
soldering operations. This configuration makes
package. Through the use of thermal paths within this
the soldering of vias that have plane connections
copper area, heat can be conducted away from the
easier. In this application, however, low thermal
package
into
either
a
ground
plane
or
other
resistance is desired for the most efficient heat
heat-dissipating device. Soldering the PowerPAD to
transfer.
Therefore,
the
holes
under
the
the printed circuit board (PCB) is always required,
BUF08821 PowerPAD package should make
even
with
applications
that
have
low
power
their connection to the internal plane with a
dissipation. This technique provides the necessary
complete
connection
around
the
entire
thermal and mechanical connection between the lead
circumference of the plated-through hole.
frame die pad and the PCB.
6. The top-side solder mask should leave the
The PowerPAD must be connected to the most
terminals of the package and the thermal pad
negative supply voltage on the device, GNDA and
area
with
its
twelve
holes
exposed.
The
GNDD.
bottom-side solder mask should cover the holes
1. Prepare the PCB with a top-side etch pattern.
of the thermal pad area. This masking prevents
There should be etching for the leads as well as
solder from being pulled away from the thermal
etch for the thermal pad.
pad area during the reflow process.
2. Place recommended holes in the area of the
7. Apply solder paste to the exposed thermal pad
thermal pad. Ideal thermal land size and thermal
area and all of the IC terminals.
via patterns for the HTSSOP-20 PWP package
8. With these preparatory steps in place, simply
can be seen in the technical brief, PowerPAD
place the BUF08821 IC in position and run the
Thermally-Enhanced
Package
chip through the solder reflow operation as any
available for download at www.ti.com. These
standard
surface-mount
component.
This
holes should be 13 mils (0,33mm) in diameter.
preparation results in a properly installed part.
Keep them small, so that solder wicking through
the holes is not a problem during reflow. An
18
Copyright 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): BUF08821
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| BUF08821AIPWPRG4 | 功能描述:LCD Gamma缓冲器 8 Ch LCD Gamma Buffer RoHS:否 制造商:Maxim Integrated 输入补偿电压: 转换速度: 电源电压-最大:20 V 电源电压-最小:9 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:TQFN-38 封装:Tube |
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| BUF08821BIPWPR | 功能描述:LCD Gamma缓冲器 Progr Gamma-Voltage Gen & Vcom Calibr RoHS:否 制造商:Maxim Integrated 输入补偿电压: 转换速度: 电源电压-最大:20 V 电源电压-最小:9 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:TQFN-38 封装:Tube |
| BUF08821EVM | 功能描述:放大器 IC 开发工具 BUF08821 Eval Mod RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| BUF08821EVM-USB | 功能描述:放大器 IC 开发工具 BUF08821 EVAL MOD RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
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