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参数资料
型号： BX80547RE2800CN
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775
封装： FLIP CHIP, LGA-775
文件页数： 34/94页
文件大小： 2796K
代理商： BX80547RE2800CN
4
Datasheet
5.2.2
Thermal Monitor 2 .................................................................................. 75
5.2.3
On-Demand Mode.................................................................................. 76
5.2.4
PROCHOT# Signal ................................................................................ 77
5.2.5
THERMTRIP# Signal ............................................................................. 77
5.2.6
TCONTROL and Fan Speed Reduction .................................................... 77
5.2.7
Thermal Diode........................................................................................ 78
6
Features ........................................................................................................................... 79
6.1
Power-On Configuration Options ........................................................................ 79
6.2
Clock Control and Low Power States.................................................................. 79
6.2.1
Normal State .......................................................................................... 80
6.2.2
HALT Powerdown State ......................................................................... 80
6.2.3
Stop-Grant States .................................................................................. 81
6.2.4
HALT Snoop State, Grant Snoop State ................................................. 81
7
Boxed Processor Specifications....................................................................................... 83
7.1
Mechanical Specifications ................................................................................... 84
7.1.1
Boxed Processor Cooling Solution Dimensions ..................................... 84
7.1.2
Boxed Processor Fan Heatsink Weight.................................................. 86
7.1.3
Boxed Processor Retention Mechanism and Heatsink Attach
Clip Assembly ........................................................................................ 86
7.2
Electrical Requirements ...................................................................................... 86
7.2.1
Fan Heatsink Power Supply ................................................................... 86
7.3
Thermal Specifications ........................................................................................ 88
7.3.1
Boxed Processor Cooling Requirements ............................................... 88
7.3.2
Variable Speed Fan ............................................................................... 90
8
Debug Tools Specifications.............................................................................................. 93
8.1
Logic Analyzer Interface (LAI) ............................................................................. 93
8.1.1
Mechanical Considerations .................................................................... 93
8.1.2
Electrical Considerations........................................................................ 93
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BX80547RE3066C 32-BIT, 3060 MHz, MICROPROCESSOR, PBGA775
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相关代理商/技术参数
参数描述
BX80547RE2800CNS L98W 制造商:Intel 功能描述:MPU Celeron? D Processor 336 90nm 2.8GHz 775-Pin FCLGA4
BX80547RE2933C S L7TP 制造商:Intel 功能描述: 制造商:Intel 功能描述:MPU CELERON D 90NM 2.93GHZ 775PIN FCLGA4 - Boxed Product (Development Kits)
BX80547RE2933CNS L98X 制造商:Intel 功能描述:32BIT MPU BX80547RE2933CN 2.93
BX805499010 制造商:Intel 功能描述:ITANIUM 1.60 GHZ - Boxed Product (Development Kits)
BX805499015 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.40 GHZ - Boxed Product (Development Kits)
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