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参数资料
| 型号： | BX80551PG2800FT |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2800 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 10/105页 |
| 文件大小： | 1870K |
| 代理商： | BX80551PG2800FT |
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12
Datasheet
Introduction
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset
components). The FSB is a multiprocessing interface to processors, memory, and I/O.
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
Intel Pentium D processor — Dual-core processor in the FC-LGA4 package with two
1-MB L2 caches.
Processor — For this document, the term processor is the generic form of the Intel Pentium D
processor.
Keep-out zone — The area on or near the processor that system design can not use.
Intel 945G/945P Express Chipset Family — Chipset that supports DDR2 memory
technology for the Pentium D processor.
Intel 955X Express Chipset — Chipset that supports DDR2 memory technology for the
Pentium D processor.
Processor core — Processor core die with integrated L2 cache.
FC-LGA4 package — The Pentium D processor is available in a Flip-Chip Land Grid Array
4 package, consisting of a processor core mounted on a substrate with an integrated heat
spreader (IHS).
LGA775 socket — The Pentium D processor mates with the system board through a surface
mount, 775-land, LGA socket.
Integrated heat spreader (IHS) — A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Retention mechanism (RM) — Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
Storage conditions — Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
Functional operation — Refers to normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.
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