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参数资料
| 型号： | BX80552651T |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 106/108页 |
| 文件大小： | 3283K |
| 代理商： | BX80552651T |
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Datasheet
99
Balanced Technology Extended (BTX) Boxed Processor Specifications
8
Balanced Technology Extended
(BTX) Boxed Processor
Specifications
The Intel Pentium 4 processors will be offered as an Intel boxed processor. Intel boxed processors
are intended for system integrators who build systems from largely standard components. The
boxed Intel Pentium 4 processor will be supplied with a cooling solution known as the Thermal
Module Assembly (TMA). Each processor will be supplied with one of the two available types of
TMAs – Type I or Type II. This chapter documents motherboard and system requirements for both
the TMAs that will be supplied with the boxed Pentium 4 processor in the 775-land package. This
chapter is particularly important for OEMs that manufacture motherboards for system integrators.
Figure 8-1 shows a mechanical representation of a boxed Pentium 4 processor in the 775-land
package with a Type I TMA. Figure 8-2 illustrates a mechanical representation of a boxed Pentium
4 processor in the 775-land package with Type II TMA.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in
brackets].
Note:
Drawings in this section reflect only the specifications on the Intel boxed processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designers’ responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platforms and chassis. Refer to the Intel Pentium D
Processor, Intel Pentium Processor Extreme Edition, and Intel Pentium 4 Processor Thermal
and Mechanical Design Guidelines for further guidance.
NOTE: The duct, clip, heatsink and fan can differ from this drawing representation but the basic shape
and size will remain the same.
Figure 8-1. Mechanical Representation of the Boxed Processor with a Type I TMA
相关PDF资料 |
PDF描述 |
|---|---|
| BX80552661 | 32-BIT, 3600 MHz, MICROPROCESSOR, PBGA775 |
| BX80552651T2 | 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775 |
| BX80552641T | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| BX80552641T2 | 32-BIT, 3200 MHz, MICROPROCESSOR, PBGA775 |
| BX805555060P | 64-BIT, MICROPROCESSOR, BGA771 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80552651T2 | 制造商:Intel 功能描述:P4 651 3.4GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80552651T2 S L94W | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? 4 Processor 651 65nm 3.4GHz 775-Pin FCLGA6 |
| BX80552651T2 S L9KE | 制造商:Intel 功能描述:MPU Pentium |
| BX80552661T2 | 制造商:Intel 功能描述:P4 661 3.6GHZ LP-BTX 2MB - Boxed Product (Development Kits) |
| BX80553915 S L9KB | 制造商:Intel 功能描述: |
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