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参数资料
| 型号： | BX805555060P |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, MICROPROCESSOR, BGA771 |
| 封装： | LGA-771 |
| 文件页数： | 9/104页 |
| 文件大小： | 3690K |
| 代理商： | BX805555060P |
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Introduction
12
Dual-Core Intel Xeon Processor 5000 Series Datasheet
Thermal Design Power – Processor thermal solutions should be designed to meet
this target. It is the highest expected sustainable power while running known
power intensive real applications. TDP is not the maximum power that the
processor can dissipate.
LGA771 socket – The Dual-Core Intel Xeon Processor 5000 series interfaces to
the baseboard through this surface mount, 771 Land socket. See the LGA771
Socket Design Guidelines for details regarding this socket.
Processor – A single package that contains one or more complete execution cores.
Processor core – Processor core die with integrated L2 cache. All AC timing and
signal integrity specifications are at the pads of the processor core.
Intel Virtualization Technology – Processor virtualization which when used in
conjunction with Virtual Machine Monitor software enables multiple, robust
independent software environments inside a single platform.
VRM (Voltage Regulator Module) – DC-DC converter built onto a module that
interfaces with a card edge socket and supplies the correct voltage and current to
the processor based on the logic state of the processor VID bits.
EVRD (Enterprise Voltage Regulator Down) – DC-DC converter integrated onto
the system board that provides the correct voltage and current to the processor
based on the logic state of the processor VID bits.
VCC – The processor core power supply.
VSS – The processor ground.
VTT – FSB termination voltage.
1.2
State of Data
The data contained within this document is subject to change. It is the most accurate
information available by the publication date of this document and is based on final
silicon characterization. All specifications in this version of the Dual-Core Intel Xeon
Processor 5000 Series Datasheet can be used for platform design purposes (layout
studies, characterizing thermal capabilities, and so forth).
1.3
References
Material and concepts available in the following documents may be beneficial when
reading this document:
Document
Intel Order Number
AP-485, Intel Processor Identification and the CPUID Instruction
241618
IA-32 Intel Architecture Software Developer's Manual
Volume 1: Basic Architecture
Volume 2A: Instruction Set Reference, A-M
Volume 2B: Instruction Set Reference, N-Z
Volume 3A: System Programming Guide
Volume 3B: System Programming Guide
253665
253666
253667
253668
253669
64-bit Extension Technology Software Developer's Guide
Volume 1
Volume 2
300834
300835
IA-32 Intel Architecture Optimization Reference Manual
248966
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX805555060P S L96A | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5060 65nm 3.2GHz 771-Pin FCLGA6 |
| BX805565120P S L9RY | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5120 RISC 64-Bit 65nm 1.86GHz 771-Pin LGA Box |
| BX805565130A S LAGC | 制造商:Intel 功能描述:5100 MEMORY CONTROLLER HUB CHIPSET |
| BX805565140P S LABN | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU Xeon? Processor 5140 RISC 64-Bit 65nm 2.33GHz 1.35V/1.5V 771-Pin FCLGA6 Box |
| BX805565148A S LABH | 制造商:Intel 功能描述:MPU Xeon |
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