参数资料
型号: BX805555080P
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, MICROPROCESSOR, BGA771
封装: LGA-771
文件页数: 3/104页
文件大小: 3690K
代理商: BX805555080P
Boxed Processor Specifications
100
Dual-Core Intel Xeon Processor 5000 Series Datasheet
The fan power header on the baseboard must be positioned to allow the fan heat sink
power cable to reach it. The fan power header identification and location must be
documented in the suppliers platform documentation, or on the baseboard itself. The
baseboard fan power header should be positioned within 177.8 mm [7 in.] from the
center of the processor socket.
8.3.2
Boxed Processor Cooling Requirements
As previously stated the boxed processor will be available in two product
configurations. Each configuration will require unique design considerations. Meeting
the processor’s temperature specifications is also the function of the thermal design of
the entire system, and ultimately the responsibility of the system integrator. The
processor temperature specifications are found in Chapter 6, “Thermal Specifications”
of this document.
Table 8-1.
PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution
Description
Min Frequency
Nominal Frequency
Max Frequency
Unit
PWM Control
Frequency Range
21,000
25,000
28,000
Hz
Table 8-2.
Fan Specifications for 4-pin Active CEK Thermal Solution
Description
Min
Typ
Steady
Max
Steady
Max
Startup
Unit
+12 V: 12 volt fan power supply
10.8
12
13.2
V
IC: Fan Current Draw
N/A
1
1.25
1.5
A
SENSE: SENSE frequency
2
Pulses per fan
revolution
Figure 8-11. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution
Table 8-3.
Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution
Pin Number
Signal
Color
1
Ground
Black
2
Power: (+12 V)
Yellow
3
Sense: 2 pulses per revolution
Green
4
Control: 21 KHz-28 KHz
Blue
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