- 您现在的位置：买卖IC网 > PDF目录12901 > C0603C0G1E0R9WTQ (TDK Corporation)CAP CER 0.9PF 25V NP0 0201 PDF资料下载
参数资料
| 型号： | C0603C0G1E0R9WTQ |
| 厂商： | TDK Corporation |
| 文件页数： | 14/15页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.9PF 25V NP0 0201 |
| 特色产品： | C-Series High Q Capacitors C-Series Mid Voltage MLCCs |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 0.90pF |
| 电压 - 额定： | 25V |
| 容差： | ±0.05pF |
| 温度系数： | C0G，NP0 |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | RF，微波，高频 |
| 封装/外壳： | 0201（0603 公制） |
| 尺寸/尺寸： | 0.024" L x 0.012" W（0.60mm x 0.30mm） |
| 厚度（最大）： | 0.013"（0.33mm） |
| 特点： | 高 Q 值，低损耗 |
| 包装： | 标准包装 |
| 其它名称： | 445-7044-6 |
Packaging
Information
? Carrier Tape Configuration
C0603Series–HighQCapacitors
Bulk
160mm min.
Drawing direction
Chips
Bulk
160mm min
Leader
400mm min
? Peel Back Force (Top Tape)
Direction & angle of pull
Carrier tape
Top cover tape
Direction of pull force
0.05 – 0.7 N
0~15 °
? Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
? The missing of components shall be less than
0.1%
? Components shall not stick to the cover tape.
? The cover tape shall not protrude beyond the
edges of the carrier tape and shall not cover the
sprocket holes.
Bottom cover tape
Bottom cover tape (Paper carrier tape)
? Chip Quantity Per Reel and Structure of Reel
Paper Carrier Tape & Reel
Top cover tape
Pitch hole
Paper carrier tape
(Bottom cover tape is not always applied)
Case Code
JIS EIA
C0603 CC0201
Chip
Thickness
(mm)
0.30
Taping
Material
Paper
Chip quantity (pcs.)
φ178mm (7”) reel
15,000
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
TDK MLCC US Catalog
Page 160
Version B11
相关PDF资料 |
PDF描述 |
|---|---|
| C0603X5R1A224M | CAP CER 0.22UF 10V 20% X5R 0201 |
| VE-J6W-CY-F1 | CONVERTER MOD DC/DC 5.5V 50W |
| C1005X8R1H332K | CAP CER 3300PF 50V 10% X8R 0402 |
| VE-J6V-CY-F4 | CONVERTER MOD DC/DC 5.8V 50W |
| C1005X8R1H152K | CAP CER 1500PF 50V 10% X8R 0402 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| C0603C0G1E100C | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 10pF 0.25pF 25Volts RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C0603C0G1E100C/60 | 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0201, T.C: C0G, Voltage: 25, Cap Value: 10, Tol: +/-0.25pF |
| C0603C0G1E100CT | 制造商:TDK 制造商全称:TDK Electronics 功能描述:Multilayer Ceramic Chip Capacitors |
| C0603C0G1E100D | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0201 4.0volts 10pF C0G +/-0.5pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C0603C0G1E100D/60 | 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0201, T.C: C0G, Voltage: 25, Cap Value: 10, Tol: +/-0.50pF |
发布紧急采购，3分钟左右您将得到回复。