参数资料
型号: C0603X473K5NAC7867
厂商: Kemet
文件页数: 11/18页
文件大小: 0K
描述: CAP CER 0.047UF 50V 10% X8L 0603
标准包装: 1
电容: 0.047µF
电压 - 额定: 50V
容差: ±10%
温度系数: X8L
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 150°C
应用: Boardflex 敏感
封装/外壳: 0603(1608 公制)
尺寸/尺寸: 0.063" L x 0.031" W(1.60mm x 0.80mm)
厚度(最大): 0.034"(0.87mm)
特点: 软端子,高温
包装: 标准包装
其它名称: 399-6289-6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with EIA
Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for details on
reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
KEM
ET
?
Embossed Plastic* or
Punched Paper Carrier.
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
178 mm (7.00")
or
330 mm (13.00")
8 mm, 12 mm
or 16 mm Carrier Tape
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Confi guration – Embossed Plastic & Punched Paper (mm)
EIA Case Size
01005 – 0402
0603 – 1210
1805 – 1808
≥ 1812
KPS 1210
KPS 1812 & 2220
Array 0508 & 0612
Tape Size (W)*
8
8
12
12
12
16
8
Pitch (P 1 )*
2
4
4
8
8
12
4
*Refer to Figures 1 & 2 for W and P 1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifi cations.
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
C1008_X8L_150C_SMD ? 12/19/2013
11
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