参数资料
型号: C0805C105K8NACTU
厂商: Kemet
文件页数: 6/18页
文件大小: 0K
描述: CAP CER 1UF 10V 10% X8L 0805
产品培训模块: High Temperature MLCCs
Capacitor Basics- Typical Uses for Capacitors
产品目录绘图: X8L,X8R Series_0805
标准包装: 1
电容: 1.0µF
电压 - 额定: 10V
容差: ±10%
温度系数: X8L
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 150°C
应用: 自动
封装/外壳: 0805(2012 公制)
尺寸/尺寸: 0.079" L x 0.049" W(2.00mm x 1.25mm)
厚度(最大): 0.039"(1.00mm)
特点: 高温
包装: 标准包装
产品目录页面: 2146 (CN2011-ZH PDF)
其它名称: 399-5731-6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity
7" Reel 13" Reel
Plastic Quantity
7" Reel 13" Reel
BB
CB
DD
DE
DG
DH
ED
EF
EG
EH
FD
FF
FG
FL
FH
FM
FK
FS
0402
0603
0805
0805
0805
0805
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
0.50 ± 0.05
0.80 ± 0.07
0.90 ± 0.10
1.00 ± 0.10
1.25 ± 0.15
1.25 ± 0.20
1.00 ± 0.10
1.20 ± 0.15
1.60 ± 0.15
1.60 ± 0.20
0.95 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
2.10 ± 0.20
2.50 ± 0.30
10,000
4,000
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50,000
10,000
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
2,500
2,500
2,000
2,000
4,000
2,500
2,500
2,000
2,000
2,000
2,000
1,000
0
0
0
10,000
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel 13" Reel
Paper Quantity
7" Reel 13" Reel
Plastic Quantity
Package quantity based on finished chip thickness specifications.
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
C
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Y X V1
V2
C
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Y X V1
V2
C
Density Level C:
Minimum (Least)
Land Protrusion (mm)
Y X V1
V2
0402
0603
0805
1206
1210
1210 1
1005
1608
2012
3216
3225
3225
0.50
0.90
1.00
1.60
1.60
1.50
0.72
1.15
1.35
1.35
1.35
1.60
0.72
1.10
1.55
1.90
2.80
2.90
2.20
4.00
4.40
5.60
5.65
5.60
1.20
2.10
2.60
2.90
3.80
3.90
0.45
0.80
0.90
1.50
1.50
1.40
0.62
0.95
1.15
1.15
1.15
1.40
0.62
1.00
1.45
1.80
2.70
2.80
1.90
3.10
3.50
4.70
4.70
4.70
1.00
1.50
2.00
2.30
3.20
3.30
0.40
0.60
0.75
1.40
1.40
1.30
0.52
0.75
0.95
0.95
0.95
1.20
0.52
0.90
1.35
1.70
2.60
2.70
1.60
2.40
2.80
4.00
4.00
4.00
0.80
1.20
1.70
2.00
2.90
3.00
Only for capacitance values ≥ 22 μF
1
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification
testing based on the conditions outlined in IPC Standard 7351 (IPC –7351).
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
C1008_X8L_150C_SMD ? 12/19/2013
6
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