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| 型号： | C0805C274K3NACTU |
| 厂商： | Kemet |
| 文件页数： | 12/18页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.27UF 25V 10% X8L 0805 |
| 产品培训模块： | High Temperature MLCCs Capacitor Basics- Typical Uses for Capacitors |
| 产品目录绘图： | X8L,X8R Series_0805 |
| 标准包装： | 1 |
| 电容： | 0.27µF |
| 电压 - 额定： | 25V |
| 容差： | ±10% |
| 温度系数： | X8L |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 150°C |
| 应用： | 自动 |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 厚度（最大）： | 0.039"（1.00mm） |
| 特点： | 高温 |
| 包装： | 标准包装 |
| 产品目录页面： | 2146 (CN2011-ZH PDF) |
| 其它名称： | 399-5728-6 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T 2
?Do
P 2
Po
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E 1
Ao
F
B 1
Ko
Bo
E 2
W
S 1
P 1
T 1
?D 1
User Direction of Unreeling
Center Lines of Cavity
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o .
Embossment
For cavity size,
see Note 1 Table 4
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
D 0
D 1 Minimum
Note 1
1.0
(0.039)
E 1
P 0
P 2
R Reference S 1 Minimum
Note 2 Note 3
25.0
(0.984)
T
Maximum
T 1
Maximum
12 mm
16 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.5
(0.059)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
30
(1.181)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
Pitch
Single (4 mm)
Single (4 mm) &
Double (8 mm)
Triple (12 mm)
B 1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E 2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
3.5 ±0.05
(0.138 ±0.002)
5.5 ±0.05
(0.217 ±0.002)
7.5 ±0.05
(0.138 ±0.002)
P 1
4.0 ±0.10
(0.157 ±0.004)
8.0 ±0.10
(0.315 ±0.004)
12.0 ±0.10
(0.157 ±0.004)
T 2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A 0 ,B 0 & K 0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B 1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A 0 , B 0 and K 0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A 0 and B 0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
C1008_X8L_150C_SMD ? 12/19/2013
12
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