参数资料
型号: C1005C0G1H681F
厂商: TDK Corporation
文件页数: 12/14页
文件大小: 0K
描述: CAP CER 680PF 50V 1% NP0 0402
特色产品: C-Series Mid Voltage MLCCs
标准包装: 1
系列: C
电容: 680pF
电压 - 额定: 50V
容差: ±1%
温度系数: C0G,NP0
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 通用
封装/外壳: 0402(1005 公制)
尺寸/尺寸: 0.039" L x 0.020" W(1.00mm x 0.50mm)
厚度(最大): 0.022"(0.55mm)
包装: 标准包装
其它名称: 445-7021-6
Soldering
Information
C Series – Tight Tolerance Capacitors
?  RecommendedSolderingLand Pattern
? Recommended Soldering Profile
Soldering Natural
Temp
Temp
C
Chip capacitor
Solder land
Peak
Wave Soldering
Soldering
Preheating
Natural
cooling
Peak
Reflow Soldering
Preheating cooling
B
A
Solder resist
△ T
? T
Wave Soldering
Type
Symbol
A
B
C
Reflow Soldering
Type
Symbol
Unit: mm
C1608
[CC0603]
0.7 - 1.0
0.8 - 1.0
0.6 - 0.8
C1005
[CC0402]
Unit: mm
C1608
[CC0603]
0
0
Over 60 sec. Over 60 sec. Over 60 sec.
Peak Temp time
Manual soldering
(Solder iron)
300
? T
Peak Temp time
A
B
C
0.3 - 0.5
0.35 - 0.45
0.4 - 0.6
0.6 - 0.8
0.6 - 0.8
0.6 - 0.8
0
Preheating
3sec. (As short as possible)
? Recommended Solder Amount
Recommended soldering duration
Temp./ Wave Soldering
Reflow Soldering
Excessive
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Dura.
Solder
Sn-Pb
Solder
Peak temp
( ° C)
250 max.
Duration
(sec.)
3 max.
Peak temp
( ° C)
230 max.
Duration
(sec.)
20 max.
260 max.
5 max.
Adequate
solder
Maximum amount
Minimum amount
Lead-Free
Solder
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
260 max.
10 max.
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Insufficient
solder
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Preheating Condition
Soldering Case Size - JIS (EIA)
Wave soldering C1608(CC0603)
Reflow soldering C1005(CC0402), C1608(CC0603)
Manual soldering
C1005(CC0402), C1608(CC0603)
Temp. (oC)
? T ≤ 150
? T ≤ 150
? T ≤ 150
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
TDK MLCC US Catalog
Page 144
Version B11
相关PDF资料
PDF描述
C1005C0G1H331F CAP CER 330PF 50V 1% NP0 0402
C3225X7R1H335M CAP CER 3.3UF 50V 20% X7R 1210
V300B28C250BG3 CONVERTER MOD DC/DC 28V 250W
V300B36C250BG3 CONVERTER MOD DC/DC 36V 250W
V300B36C250BG2 CONVERTER MOD DC/DC 36V 250W
相关代理商/技术参数
参数描述
C1005C0G1H681F050BA 制造商:TDK 功能描述:CAP 680PF 50V C0G +/-1% SMD 0402 - Tape and Reel 制造商:TDK 功能描述:CAP CER 680PF 50V 1% NP0 0402 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C1005, T.C:C0G, Voltage:1H, Cap Value:681, Tol:F, Thickness:0.5, E series: 6
C1005C0G1H681G 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0402, 680pF, 50volts C0G, +/-2% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1005C0G1H681G050BA 制造商:TDK 功能描述:CAP 680PF 50V C0G +/-2% SMD 0402 - Tape and Reel 制造商:TDK 功能描述:CAP CER 680PF 50V 2% NP0 0402 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C1005, T.C:C0G, Voltage:1H, Cap Value:681, Tol:G, Thickness:0.5, E series: 6
C1005C0G1H681J 功能描述:多层陶瓷电容器MLCC - SMD/SMT 680pF 5% 50Volts RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1005C0G1H681J(050BA) 制造商:TDK 制造商全称:TDK Electronics 功能描述:Multilayer Ceramic Chip Capacitors