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参数资料
| 型号： | C1206C300DGGAC |
| 厂商： | KEMET Corporation |
| 英文描述： | CERAMIC CHIP / HIGH VOLTAGE |
| 中文描述： | 陶瓷芯片/高电压 |
| 文件页数： | 5/9页 |
| 文件大小： | 1636K |
| 代理商： | C1206C300DGGAC |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape
fed
automatic
pick
and
place
systems. See page
7
8
for details on reeling quantities for commercial chips
and page
87
for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape
fed
automatic
pick
and
place
systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
8mm
±
.30
(.315
±
.012")
or
12mm
±
.30
(.472
±
.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
KEMET
X
C
G
Z
Y
Grid
placement
courtyard
"
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
Z
3.18
3.70
4.90
4.90
G
0.68
0.70
1.50
1.50
X
0.80
1.10
1.40
2.00
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
Wave Solder
Reflow Solder
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
0402
0603
0805
1206
1210
1812
1825
2220
2225
Dimension
Not Recommended
Not Recommended
#
$
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
93
P
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C1206C300F1GAC TU | 制造商:KEMET Corporation 功能描述:CAP 30PF 100VDC C0G 1% SMD 1206 - Tape and Reel |
| C1206C300F1GACTU | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100volts 30pF C0G 1% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1206C300F1HAC7800 | 功能描述:CAP CER 1206 30PF 100V ULTRA STA 制造商:kemet 系列:C 包装:带卷（TR） 零件状态:在售 电容:30pF 容差:±1% 电压 - 额定:100V 温度系数:X8R 工作温度:-55°C ~ 150°C 特性:低 ESL，高温 等级:- 应用:通用 故障率:- 安装类型:表面贴装，MLCC 封装/外壳:1206（3216 公制） 大小/尺寸:0.126" 长 x 0.063" 宽（3.20mm x 1.60mm） 高度 - 安装（最大值）:- 厚度（最大值）:0.035"（0.88mm） 引线间距:- 标准包装:4,000 |
| C1206C300F1HACAUTO | 功能描述:CAP CER 1206 30PF 100V ULTRA STA 制造商:kemet 系列:C 包装:带卷（TR） 零件状态:在售 电容:30pF 容差:±1% 电压 - 额定:100V 温度系数:X8R 工作温度:-55°C ~ 150°C 特性:低 ESL，高温 等级:AEC-Q200 应用:汽车级 故障率:- 安装类型:表面贴装，MLCC 封装/外壳:1206（3216 公制） 大小/尺寸:0.126" 长 x 0.063" 宽（3.20mm x 1.60mm） 高度 - 安装（最大值）:- 厚度（最大值）:0.035"（0.88mm） 引线间距:- 标准包装:4,000 |
| C1206C300F3GACTU | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 25volts 30pF C0G 1% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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