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参数资料
| 型号： | C1206X105K3NAC7800 |
| 厂商： | Kemet |
| 文件页数： | 13/18页 |
| 文件大小： | 0K |
| 描述： | CAP CER 1UF 25V 10% X8L 1206 |
| 标准包装： | 1 |
| 电容： | 1.0µF |
| 电压 - 额定： | 25V |
| 容差： | ±10% |
| 温度系数： | X8L |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 150°C |
| 应用： | Boardflex 敏感 |
| 封装/外壳： | 1206（3216 公制） |
| 尺寸/尺寸： | 0.130" L x 0.063" W（3.30mm x 1.60mm） |
| 厚度（最大）： | 0.043"（1.10mm） |
| 特点： | 软端子，高温 |
| 包装： | 标准包装 |
| 其它名称： | 399-6285-6 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
?Do
P 2
Po
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E 1
A 0
F
Bottom Cover Tape
B 0
E 2
W
T 1
T 1
Top Cover Tape
Center Lines of Cavity
P 1
G
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Tape Size
D 0
Constant Dimensions — Millimeters (Inches)
E 1 P 0 P 2
T 1 Maximum
G Minimum
R Reference
Note 2
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004) Maximum
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
8 mm
8 mm
Pitch
Half (2 mm)
Single (4 mm)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P 1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
T Maximum
1.1
(0.098)
W Maximum
8.3
(0.327)
8.3
(0.327)
A 0 B 0
Note 1
1. The cavity defi ned by A 0 , B 0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
C1008_X8L_150C_SMD ? 12/19/2013
13
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| C1206X105K3NACTU | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 25v 1uF 10% Tol. X8L Flex Term RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1206X105K3RAC | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 1.00UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1206X105K3RAC TU | 制造商:KEMET Corporation 功能描述:CAPACITOR CERAMIC 1UF 25V X7R 1206 |
| C1206X105K3RAC7800 | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 1.00UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1206X105K3RACAUTO | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 25volts 1uF 10% C0G 1206 X7R RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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