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| 型号： | C1210C684K5NACTU |
| 厂商： | Kemet |
| 文件页数： | 14/18页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.68UF 50V 10% X8L 1210 |
| 产品培训模块： | High Temperature MLCCs Capacitor Basics- Typical Uses for Capacitors |
| 产品目录绘图： | X8L,X8R Series_1210 |
| 标准包装： | 1 |
| 电容： | 0.68µF |
| 电压 - 额定： | 50V |
| 容差： | ±10% |
| 温度系数： | X8L |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 150°C |
| 应用： | 自动 |
| 封装/外壳： | 1210（3225 公制） |
| 尺寸/尺寸： | 0.126" L x 0.098" W（3.20mm x 2.50mm） |
| 厚度（最大）： | 0.055"（1.40mm） |
| 特点： | 高温 |
| 包装： | 标准包装 |
| 产品目录页面： | 2146 (CN2011-ZH PDF) |
| 其它名称： | 399-5736-6 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 150°C, X8L Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
8 mm
12 and 16 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624 .
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Typical Pocket Centerline
Maximum Component Rotation
Side View
Width (mm)
Rotation (
T )
S )
Bo
Ao
Tape Maximum
°
8,12 20
16 – 200 10
Typical Component Centerline
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
°
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
16 mm Tape
1.0 mm maximum
1.0 mm maximum
Embossed
Carrier
R
Bending
Radius
Punched
Carrier
R
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
C1008_X8L_150C_SMD ? 12/19/2013
14
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| C1210C684K5RAC | 功能描述:多层陶瓷电容器MLCC - SMD/SMT .680UF 50.0V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1210C684K5RAC7210 | 制造商:KEMET Corporation 功能描述:Cap Ceramic 0.68uF 50V X7R 10% SMD 1210 125 |
| C1210C684K5RAC7800 | 制造商:KEMET Corporation 功能描述: |
| C1210C684K5RACTU | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 50volts 0.68uF X7R 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1210C684M3RAC | 功能描述:多层陶瓷电容器MLCC - SMD/SMT .680UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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