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参数资料
| 型号： | C1632X5R0J475K |
| 厂商： | TDK Corporation |
| 文件页数： | 15/16页 |
| 文件大小： | 0K |
| 描述： | CAP CER 4.7UF 6.3V 10% X5R 1206 |
| 产品培训模块： | High Capacitance Replacement |
| 产品目录绘图： | C SERIES_0612_1.45 |
| 特色产品： | C-Series Mid Voltage MLCCs |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 4.7µF |
| 电压 - 额定： | 6.3V |
| 容差： | ±10% |
| 温度系数： | X5R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 85°C |
| 应用： | 旁通，去耦 |
| 封装/外壳： | 1206（3216 公制）宽（长侧）0612（1632 公制） |
| 尺寸/尺寸： | 0.063" L x 0.126" W（1.60mm x 3.20mm） |
| 厚度（最大）： | 0.057"（1.45mm） |
| 特点： | 低 ESL 型（倒置结构） |
| 包装： | 标准包装 |
| 产品目录页面： | 2182 (CN2011-ZH PDF) |
| 其它名称： | 445-1821-6 |
Packaging
Information
? Carrier Tape Configuration
CSeries–LowESLFlipType
Bulk
160mm min.
Drawing direction
Chips
Bulk
160mm min
Leader
400mm min
? Peel Back Force (Top Tape)
Carrier tape
Direction & angle of pull
Top cover tape
0.05 – 0.7 N
0~15 °
? Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
? The missing of components shall be less than
0.1%
? Components shall not stick to the cover tape.
? The cover tape shall not protrude beyond the
edges of the carrier tape not shall cover the
sprocket holes.
Direction of pull force
Bottom cover tape (Paper carrier tape of type 2)
? Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
Paper Carrier Tape & Reel (Type 1)
Top cover tape
Pitch hole
Cavity (Press formed type)
Paper Carrier Tape & Reel (Type 3)
Paper Carrier Tape & Reel (Type 2)
Top cover tape
Pitch hole
Cavity (Chip insert)
Paper carrier tape
Bottom cover tape
Top cover tape
Pitch hole
Cavity (Chip insert)
Paper carrier tape
Plastic carrier tape
Case Code
JIS EIA
C0510 CC0204
Chip
Thickness
0.50 mm
Taping Material
Paper (Type 1)
Chip quantity (pcs.)
φ178mm (7”) reel φ330mm (13”) reel
15,000 50,000
C0816
C1220
CC0306
CC0508
0.80 mm
0.85 mm
Plastic (Type 3)
Paper (Type 2)
4,000
4,000
10,000
10,000
0.70 mm
4,000
C1632
CC0612
1.15 mm
1.30 mm
Plastic (Type 3)
2,000
10,000
TDK MLCC US Catalog
Page 209
Version B11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C1632X5R0J475K/10 | 制造商:TDK CORPORATION OF AMERICA 功能描述:MLCC - Flip Type |
| C1632X5R0J475KT | 制造商:TDK Epcos 功能描述: |
| C1632X5R0J475M | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 6.3V 4.7uF X5R 20% Flip chip 0612 RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1632X5R0J475M/10 | 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0612, T.C: X5R, Voltage: 6.3, Cap Value: 4700000, Tol: +/-20% |
| C1632X5R0J475M130AC | 制造商:TDK 功能描述:CAP 4.7UF 6.3VDC X5R 20% SMD 0612 - Tape and Reel 制造商:TDK 功能描述:CAP CER 4.7UF 6.3V 20% X5R 0612 制造商:TDK 功能描述:CAPACITOR CERAMIC 4.7UF, 6.3V, X5R, 20%, 0612; Capacitance:4.7F; Capacitance Tolerance: 20%; Dielectric Characteristic:X5R; Voltage Rating:6.3V; Capacitor Case Style:0612 [1632 Metric]; Capacitor Terminals:SMD; No. of Pins:2 ;RoHS Compliant: Yes 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C1632, T.C:X5R, Voltage:0J, Cap Value:475, Tol:M, Thickness:1.3, E series: 3 |
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