参数资料
型号: C1812C106M3R2CTU
厂商: Kemet
文件页数: 9/17页
文件大小: 0K
描述: CAP CER 10UF 25V 20% X7R 1812
产品培训模块: Capacitor Basics- Typical Uses for Capacitors
产品目录绘图: KPS Series_1812-Double
标准包装: 1
系列: KPS
电容: 10µF
电压 - 额定: 25V
容差: ±20%
温度系数: X7R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 旁通,去耦
封装/外壳: 堆叠式 SMD,2条 J 型引线
尺寸/尺寸: 0.197" L x 0.138" W(5.00mm x 3.50mm)
厚度(最大): 0.217"(5.50mm)
特点: 低 ESL 型(堆栈型)
包装: 标准包装
产品目录页面: 2146 (CN2011-ZH PDF)
其它名称: 399-5812-6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40oC and maximum storage humidity not exceed 70%
relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.
Construction
Reference
A
B
C
D
E
F
G
Item
Leadframe
Leadframe Attach
Termination
Inner Electrode
Dielectric Material
Material
Phosphor Bronze - Alloy 510
HMP Solder
Cu
Ni
Sn
Ni
BaTiO 3
Note: Image is exaggerated in order to clearly identify all components of construction.
HMP = High Melting Point
Product Marking
Laser marking option is not available on:
?
?
?
?
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
C1021_X7R_KPS_AUTO_SMD ? 5/30/2013
9
相关PDF资料
PDF描述
TC7107IPL IC ADC 3 1/2DGT LED DVR 40-DIP
T95R187K016LSSL CAP TANT 180UF 16V 10% 2824
MLF2012DR22K INDUCTOR MULTILAYER 0.22UH 0805
T95R227K010LSSL CAP TANT 220UF 10V 10% 2824
CR54NP-100MC INDUCTOR POWER 10UH 1.44A SMD
相关代理商/技术参数
参数描述
C1812C106M3RAC 功能描述:多层陶瓷电容器MLCC - SMD/SMT 10.0UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1812C106M3RAC7800 功能描述:多层陶瓷电容器MLCC - SMD/SMT 10.0UF 25.0V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1812C106M3RACTU 功能描述:多层陶瓷电容器MLCC - SMD/SMT 25volts 10uF X7R 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1812C106M3RALTU 功能描述:多层陶瓷电容器MLCC - SMD/SMT 25volts 10uF X7R 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1812C106M4R1C7289 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:Surface Mount Multilayer Ceramic Chip Capacitors