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| 型号： | C1812C474MAR2CTU |
| 厂商： | Kemet |
| 文件页数： | 8/17页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.47UF 250V 20% X7R 1812 |
| 产品培训模块： | Capacitor Basics- Typical Uses for Capacitors |
| 产品目录绘图： | KPS Series_1812-Double |
| 标准包装： | 1 |
| 系列： | KPS |
| 电容： | 0.47µF |
| 电压 - 额定： | 250V |
| 容差： | ±20% |
| 温度系数： | X7R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 旁通，去耦 |
| 封装/外壳： | 堆叠式 SMD，2条 J 型引线 |
| 尺寸/尺寸： | 0.197" L x 0.138" W（5.00mm x 3.50mm） |
| 厚度（最大）： | 0.217"（5.50mm） |
| 特点： | 低 ESL 型（堆栈型） |
| 包装： | 标准包装 |
| 产品目录页面： | 2146 (CN2011-ZH PDF) |
| 其它名称： | 399-5810-6 |
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS Series, X7R Dielectric, 10 – 250 VDC (Automotive Grade)
Table 3 – KPS Land Pattern Design Recommendations (mm)
EIA SIZE
CODE
METRIC
SIZE
CODE
Median (Nominal) Land Protrusion
C Y X V1 V2
1210
1812
2220
3225
4532
5650
1.50
2.20
2.69
1.14
1.35
2.08
1.75
2.87
4.78
5.05
6.70
7.70
3.40
4.50
6.00
Soldering Process
KEMET’s KPS Series devices are compatible with IR reflow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended profile
conditions for IR reflow reflect the profile conditions of the
IPC/J–STD–020D standard for moisture sensitivity testing.
Profile Feature
Preheat/Soak
Temperature Minimum (T Smin )
Temperature Maximum (T Smax )
Time (t s ) from T smin to T smax )
SnPb Assembly Pb-Free Assembly
100°C 150°C
150°C 200°C
60 – 120 seconds 60 – 120 seconds
20 seconds maximum
10 seconds maximum
To prevent degradation of temperature cycling capability, care
must be taken to prevent solder from flowing into the inner side
of the lead frames (inner side of "J" lead in contact with the
circuit board).
After soldering, the capacitors should be air cooled to room
temperature before further processing. Forced air cooling is not
recommended.
Ramp-up Rate (T L to T P ) 3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (T L ) 183°C 217°C
Time Above Liquidous (t L ) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T P ) 235°C 250°C
Time within 5°C of Maximum
Peak Temperature (t P )
Ramp-down Rate (T P to T L ) 6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be taken
to avoid contact of the soldering iron to the capacitor body. The
iron should be used to heat the solder pad, applying solder
between the pad and the lead, until reflow occurs. Once reflow
occurs, the iron should be removed immediately. (Preheating is
required when hand soldering to avoid thermal shock.)
T P
T L
T smax
T smin
Maximum Ramp Up Rate = 3oC/seconds
Maximum Ramp Down Rate = 6oC/seconds
t S
t L
t P
25
25oC to Peak
Time
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
C1021_X7R_KPS_AUTO_SMD ? 5/30/2013
8
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参数描述 |
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| C1812C474MARAC | 功能描述:多层陶瓷电容器MLCC - SMD/SMT .470UF 250V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1812C474MARAC7800 | 制造商:KEMET Corporation 功能描述: |
| C1812C474MARACTU | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 250volts 0.47uF 20% X7R RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1812C474Z5UAC | 功能描述:多层陶瓷电容器MLCC - SMD/SMT .470UF 50.0V RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C1812C474Z5UAC7025 | 制造商:KEMET Corporation 功能描述: |
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