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参数资料
| 型号： | C2012X7R1H104KT5 |
| 厂商： | TDK Corporation |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.1UF 50V 10% X7R 0805 |
| 产品目录绘图： | C Series |
| 特色产品： | C-Series Mid Voltage MLCCs |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 0.1µF |
| 电压 - 额定： | 50V |
| 容差： | ±10% |
| 温度系数： | X7R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 厚度（最大）： | 0.057"（1.45mm） |
| 包装： | 标准包装 |
| 其它名称： | 445-6045-6 |
Soldering
Information
? Recommended Soldering Land Pattern
CSeries–OpenModeDesign
? Recommended Soldering Profile
Soldering Natural
C
Chip capacitor
Solder land
Peak
Temp
Wave Soldering
Soldering
Preheating
Natural
cooling
Peak
Temp
Reflow Soldering
Preheating cooling
B
A
Solder resist
? T
? T
Wave Soldering
Type C2012
Symbol [CC0805]
A 1.0 - 1.3
B 1.0 - 1.2
C
0.8 - 1.1
Reflow Soldering
Type C2012
Symbol [CC0805]
Unit: mm
C3216
[CC1206]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
Unit: mm
C3216
[CC1206]
0
0
Over 60 sec. Over 60 sec. Over 60 sec.
Peak Temp time
Manual soldering
(Solder iron)
300
? T
Peak Temp time
A
B
C
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
0
Preheating
3sec. (As short as possible)
250 max.
3 max.
260 max.
5 max.
Reflow Soldering
Type C3225
Symbol [CC1210]
A 2.0 - 2.4
B 1.0 - 1.2
C 1.9 - 2.5
C4532
[CC1812]
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C5750
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Recommended soldering duration
Temp./ Wave Soldering
Dura. Peak temp Duration
Solder ( ° C) (sec.)
Sn-Pb
Solder
Lead-Free
Solder
Reflow Soldering
Peak temp Duration
( ° C) (sec.)
230 max. 20 max.
260 max. 10 max.
? Recommended Solder Amount
Recommended solder compositions
Excessive
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Preheating Condition
Soldering
Case Size - JIS (EIA)
Temp. (oC)
Adequate
solder
Insufficient
solder
TDK MLCC US Catalog
Maximum amount
Minimum amount
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Wave
soldering
Reflow
soldering
Manual
soldering
Page 192
C2012(CC0805), C3216(CC1206)
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
? T ≤ 150
? T ≤ 150
? T ≤ 130
? T ≤ 150
? T ≤ 130
Version B11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C2012X7R1H104M | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.10uF 50volts X7R 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C2012X7R1H104M/0.85 | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100000pF 20% 50Volts RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C2012X7R1H104M/1.25 | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100000pF 20% 50Volts RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C2012X7R1H104M/10 | 制造商:TDK CORPORATION OF AMERICA 功能描述:MLCC |
| C2012X7R1H104M085AA | 制造商:TDK Innoveta 功能描述:Cap Ceramic 0.1uF 50V X7R 20% SMD 0805 125C T/R 制造商:TDK 功能描述:CAP .1UF 50VDC X7R 20% SMD 0805 - Tape and Reel 制造商:TDK 功能描述:CAP CER 0.1UF 50V 20% X7R 0805 制造商:TDK 功能描述:0.1uF 20% 50V X7R 0805 Multilayer Ceramic Capacitor 制造商:TDK 功能描述:CAPACITOR CERAMIC, 0.1UF, 50V, X7R, 20%, 0805; Capacitance:0.1F; Capacitance Tolerance: 20%; Dielectric Characteristic:X7R; Voltage Rating:50V; Capacitor Case Style:0805 [2012 Metric]; Capacitor Terminals:SMD; No. of Pins:2 ;RoHS Compliant: Yes 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C2012, T.C:X7R, Voltage:1H, Cap Value:104, Tol:M, Thickness:0.85, E series: 1 |
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