参数资料
型号: C2012X7S2A334M
厂商: TDK Corporation
文件页数: 23/30页
文件大小: 0K
描述: CAP CER 0.33UF 100V 20% X7S 0805
产品目录绘图: C SERIES_0805_1.45
特色产品: Mid Voltage X7S-100V MLCCs
C-Series Mid Voltage MLCCs
标准包装: 1
系列: C
电容: 0.33µF
电压 - 额定: 100V
容差: ±20%
温度系数: X7S
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 通用
封装/外壳: 0805(2012 公制)
尺寸/尺寸: 0.079" L x 0.049" W(2.00mm x 1.25mm)
厚度(最大): 0.057"(1.45mm)
包装: 标准包装
其它名称: 445-6041-6
General
Specifications
C Series – Mid Voltage Application
No.
8
9
Item
Temperature
Characteristics
of Capacitance
(Class 2)
Robustness of
Terminations
Performance
Capacitance Change (%)
No Voltage Applied
X7R: ± 15%
X7S: ± 22%
X7T: +22/-33%
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Test or Inspection Method
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
? C be calculated ref. STEP 3 readin g
Step Temperature (oC)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
Reflow solder the capacitors on P.C. board (shown in
Appendix 1a or Appendix 1b) and apply a pushing
force of 2N (C1005) or 5N (C1608, C2012, C3216,
C3225, C4532, C5750) with 10 ± 1s.
Pushing force
Capacitor
P.C. board
10
Bending
No mechanical damage.
Reflow solder the capacitors on P.C. board (shown in
Appendix 2a or Appendix 2b) and bend 1mm.
20
50
F
R230
1
45
45
Unit: mm
11
Solderability
New solder to cover over 75% of
termination.
25% may have pin holes or rough spots
but not concentrated in one spot.
Ceramic surface of A sections shall not
be exposed due to melting or shifting of
termination material.
Completely soak both terminations in
solder at 235 ± 5 ° C for 2 ± 0.5s.
Solder : H63A (JIS Z 3282)
Flux : Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
A section
TDK MLCC US Catalog
Page 97
Version B11
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