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参数资料
| 型号： | C2012X7T2W473M/SOFT |
| 厂商： | TDK Corporation |
| 文件页数： | 3/16页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.047UF 450V X7T 0805 |
| 特色产品： | C-Series Mid Voltage MLCCs Soft Termination MLCC |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 0.047µF |
| 电压 - 额定： | 450V |
| 容差： | ±20% |
| 温度系数： | X7T |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | Boardflex 敏感 |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 厚度（最大）： | 0.057"（1.45mm） |
| 特点： | 软端子 |
| 包装： | 标准包装 |
| 其它名称： | 445-6811-6 |
C Series
Soft Termination Type
Type: C2012, C3216, C3225, C4532, C5750
Features
? Conductive resin layer inside the terminal electrode
absorbs external stress from thermal or mechanical
sources.
? Improved board bending resistance and drop resistance
prevents crack occurrence within the ceramic component.
? Reduce risk of solder cracks due to thermal shock and
temperature cycling as well as improved board adherences.
Standard Product Soft Termination
Applications
? ECU / Sensor module / ABS units / HID
and other automotive electronic
equipment
? Switching power supply
? Telecom base station
? Electronic circuits mounted on alumina
substrate
? SMT application which requires bending
robustness
? Pb-free solder application in which
solder joint reliability is problematic
Shape &
Dimensions
? A resin electrode layer between the copper base
and the nickel plating of the terminal electrode absorbs
bending stress from the board and suppresses the
forming of solder cracks. Conductive resin is made of
epoxy mixed with a filler of conductive particles.
Dimensions in mm
L
W
T
B
Body Length
Body Width
Body Height
Terminal Width
Part Number
Construction
Series Name
Dimensions L x W (mm)
Case Code Length
Width
C
3225
X7S 1H 106 M /SOFT
Termination Type
Termination Code
/SOFT
Style
Epoxy Termination
C2012 2.00 ± 0.20
C3216 3.20 ± 0.20
C3225 3.20 ± 0.40
C4532 4.50 ± 0.40
C5750 5.70 ± 0.40
Temperature Characteristic
Temperature Capacitance
Characteristics Change
X7R ± 15%
X7S ± 22%
X7T +22/-33%
Rated Voltage (DC)
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.30
3.20 ± 0.40
5.00 ± 0.40
Temperature
Range
-55 to +125oC
-55 to +125oC
-55 to +125oC
Capacitance Tolerance
Tolerance Code Tolerance
M ± 20%
Nominal Capacitance (pF)
The capacitance is expressed in three
digit codes and in units of pico Farads
(pF). The first and second digits identify
the first and second significant figures of
the capacitance. The third digit identifies
the multiplier. R designates a decimal
point.
Voltage Code
1C
1E
1V
1H
2A
2E
2W
2J
Voltage (DC)
16V
25V
35V
50V
100V
250V
450V
630V
Capacitance Code
0R5
010
102
105
Capacitance
0.5pF
1pF
1,000pF (1nF)
1,000,000pF (1μF)
TDK MLCC US Catalog
Page 165
Version B11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C2012X8R1C105K | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 16V 1.0uF X8R RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C2012X8R1C105K/EPOXY | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 1.0uF 16V X8R No Solder-Glue Only RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C2012X8R1C105K125AB | 制造商:TDK 功能描述:CAP 1UF 16V X8R 10% SMD 0805 - Tape and Reel 制造商:TDK 功能描述:CAP CER 1UF 16V 10% X8R 0805 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C2012, T.C:X8R, Voltage:1C, Cap Value:105, Tol:K, Thickness:1.25, E series: 1 |
| C2012X8R1C105K125AE | 功能描述:1μF 16V 陶瓷电容器 X8R 0805（2012 公制） 0.079" 长 x 0.049" 宽（2.00mm x 1.25mm） 制造商:tdk corporation 系列:C 包装:剪切带（CT） 零件状态:有效 电容:1μF 容差:±10% 电压 - 额定:16V 温度系数:X8R 安装类型:表面贴装，MLCC 工作温度:-55°C ~ 150°C 应用:Boardflex 敏感 等级:- 封装/外壳:0805（2012 公制） 大小/尺寸:0.079" 长 x 0.049" 宽（2.00mm x 1.25mm） 高度 - 安装（最大值）:- 厚度（最大值）:0.059"（1.50mm） 引线间距:- 特性:软端子 引线形式:- 标准包装:1 |
| C2012X8R1C105M125AB | 制造商:TDK 功能描述:CAP CER 1UF 16V 20% X8R 0805 |
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