参数资料
型号: C2012X8R1E154K/0.85
厂商: TDK Corporation
文件页数: 9/16页
文件大小: 0K
描述: CAP CER 0.15UF 25V 10% X8R 0805
特色产品: C-Series Mid Voltage MLCCs
标准包装: 1
系列: C
电容: 0.15µF
电压 - 额定: 25V
容差: ±10%
温度系数: X8R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 150°C
应用: 通用
封装/外壳: 0805(2012 公制)
尺寸/尺寸: 0.079" L x 0.049" W(2.00mm x 1.25mm)
厚度(最大): 0.037"(0.95mm)
特点: 高温
包装: 标准包装
其它名称: 445-7782-6
General
Specifications
C Series – High Temperature Application
No.
1
2
3
Item
External
Appearance
Insulation
Resistance
Voltage Proof
Performance
No defects which may affect
performance.
10,000M Ω or 500 M Ω ? μ F min.
Withstand test voltage without
insulation breakdown or other damage.
Test or Inspection Method
Inspect with magnifying glass (3 × ).
Apply rated voltage for 60s.
2.5 x VDC rated voltage shall be applied for 1 ~ 5s.
Charge / discharge current shall not exceed 50mA.
4
Capacitance
Within the specified tolerance.
Measuring
Frequency
Measuring
Voltage
1kHz ± 10%
1.0 ± 0.2V rms
5
Dissipation
Factor
T.C.
X8R
D.F.
0.03 max.
See No.4 in this table for measuring condition.
6
7
Temperature
Characteristics
of Capacitance
Robustness of
Terminations
Capacitance Change (%)
No Voltage Applied
X8R: ± 15%
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
? C be calculated ref. STEP3 reading
Step
Temperature (oC)
1
Reference temp. ± 2
2
Min. operating temp. ± 2
3
Reference temp. ± 2
4
Max. operating temp. ± 2
Reflow solder the capacitor on a P.C. board (shown in
Appendix 1) and apply a pushing force of 5N (C1608,
C2012, C3216, C3225 type) and 2N (C1005 type) for
10 ± 1s.
Pushing force
Capacitor
P.C. board
8
Bending
No mechanical damage.
Reflow solder the capacitor on a P.C. board (shown in
Appendix 2) and bend 1mm as illustrated:
20
50
45
F
R230
45
1
Unit: mm
TDK MLCC US Catalog
Page 125
Version B11
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