参数资料
型号: C3225X7R1A226M/2.30
厂商: TDK Corporation
文件页数: 63/72页
文件大小: 0K
描述: CAP CER 22UF 10V 20% X7R 1210
特色产品: C-Series Mid Voltage MLCCs
标准包装: 1
系列: C
电容: 22µF
电压 - 额定: 10V
容差: ±20%
温度系数: X7R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 通用
封装/外壳: 1210(3225 公制)
尺寸/尺寸: 0.126" L x 0.098" W(3.20mm x 2.50mm)
厚度(最大): 0.098"(2.50mm)
包装: 标准包装
其它名称: 445-7731-6
General
Specifications
C Series – General Application
No.
7
8
Item
Temperature
Characteristics
of Capacitance
(Class 1)
Temperature
Characteristics
of Capacitance
(Class 2)
Performance
T.C. Temperature Coefficient
C0G 0 ± 30 (ppm/oC)
Capacitance drift
Within ± 0.2% or ± 0.05pF, whichever
larger.
Capacitance Change (%)
No Voltage Applied
X5R: ± 15%
X7R: ± 15%
X6S: ± 22%
X7S: ± 22%
X7T: +22/-33%
Y5V: + 22/-82%
Test or Inspection Method
Temperature coefficient shall be calculated based on
values at 25oC and 85oC temperature.
Measuring temperature below 20oC shall be -10oC and
-25oC.
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
? C be calculated ref. STEP 3 reading
Step Temperature (oC)
1 Reference temp. ± 2
2 Min. operating temp. ± 2
3 Reference temp. ± 2
4
Max. operating temp. ± 2
Measuring voltage: 0.1, 0.2, 0.5, 1.0V rms .
9
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Reflow solder the capacitor on P.C. board (shown in
Appendix 1a or Appendix 1b) and apply a pushing
force of 2N (C0603, C1005) or 5N (C1608, C2012,
C3216, C3225, C4532, C5750) for 10 ± 1s.
Pushing force
Capacitor
P.C. board
10
Bending
No mechanical damage.
Reflow solder the capacitor on P.C. board (shown in
Appendix 2a or Appendix 2b) and bend it for 1mm.
20
50
F
R230
1
45
45
Unit: mm
TDK MLCC US Catalog
Page 65
Version B11
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