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参数资料
| 型号： | C4520C0G3F330K |
| 厂商： | TDK Corporation |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | CAP CER 33PF 3KV 10% NP0 1808 |
| 产品目录绘图： | C SERIES_1808_1.8 |
| 特色产品： | High Voltage MLCCs C-Series Mid Voltage MLCCs |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 33pF |
| 电压 - 额定： | 3000V（3kV） |
| 容差： | ±10% |
| 温度系数： | C0G，NP0 |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 1808（4520 公制） |
| 尺寸/尺寸： | 0.177" L x 0.079" W（4.50mm x 2.00mm） |
| 厚度（最大）： | 0.071"（1.80mm） |
| 特点： | 高电压 |
| 包装： | 标准包装 |
| 产品目录页面： | 2186 (CN2011-ZH PDF) |
| 其它名称： | 445-2369-6 |
Soldering
Information
? Recommended Soldering Land Pattern
CSeries–HighVoltageApplication
? Recommended Soldering Profile
Soldering Natural
Chip capacitor
D
Slit
Solder land
Reflow Soldering
Preheating cooling
Manual soldering
(Solder iron)
Temp
C
Peak
? T
300
? T
Solder resist
B
A
? This product intended solely for reflow soldering.
? A slit of about 1mm on the circuit board is
recommended to improve removal of the flux after
soldering.
? Ensure that this product is completely dried following
washing.
? Because this product will be subjected to high
voltages, use only low-activity rosin flux (with 0.2% max.
of chlorine).
? Using this product with aluminum circuit boards must
be considered a special implementation because the
high heat stress levels are involved. In case of using
aluminum circuit boards, please contact TDK.
Reflow Soldering Unit: mm
0
0 Preheating
Over 60 sec.
Peak Temp time 3sec. (As short as possible)
Recommended soldering duration
Temp./ Reflow Soldering
Dura. Peak temp Duration
Solder ( ° C) (sec.)
Sn-Pb Solder 230 max. 20 max.
Lead-Free Solder 260 max. 10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Symbol
A
B
C
D
Type
C4520
[CC1808]
3.1 – 3.7
1.2 – 1.4
1.5 – 2.0
1.0 – 1.3
C4532
[CC1812]
3.1 – 3.7
1.2 – 1.4
2.4 – 3.2
1.0 – 1.3
Preheating Condition
Soldering
Reflow soldering
Manual soldering
Temp. (oC)
? T ≤ 130
? T ≤ 130
? Recommended Solder Amount
Excessive
solder
Adequate
solder
Insufficient
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Maximum amount
Minimum amount
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
TDK MLCC US Catalog
Page 114
Version B11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C4520C0G3F330K/3 | 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 1808, T.C: C0G, Voltage: 3000, Cap Value: 33, Tol: +/-10% |
| C4520C0G3F330K160KA | 制造商:TDK 功能描述:CAP CER 33PF 3KV 10% NP0 1808 制造商:TDK 功能描述:CAPACITOR, 33PF, 1808, 3000V, +/-10% 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C4520, T.C:C0G, Voltage:3F, Cap Value:330, Tol:K, Thickness:1.6, E series: 6 |
| C4520C0G3F330KT | 制造商:TDK 功能描述:1808 C0G ceramic capacitor 3kV 33pF |
| C4520C0G3F390K | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 1808 39pF 3KV C0G 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C4520C0G3F390K/3 | 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 1808, T.C: C0G, Voltage: 3000, Cap Value: 39, Tol: +/-10% |
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