参数资料
型号: C5750X7R1H475KT5
厂商: TDK Corporation
文件页数: 15/16页
文件大小: 0K
描述: CAP CER 4.7UF 50V 10% X7R 2220
产品目录绘图: C Series
特色产品: C-Series Mid Voltage MLCCs
标准包装: 1
系列: C
电容: 4.7µF
电压 - 额定: 50V
容差: ±10%
温度系数: X7R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 通用
封装/外壳: 2220(5750 公制)
尺寸/尺寸: 0.224" L x 0.197" W(5.70mm x 5.00mm)
厚度(最大): 0.122"(3.10mm)
包装: 标准包装
其它名称: 445-6123-6
Packaging
Information
? Carrier Tape Configuration
CSeries–OpenModeDesign
Bulk
160mm min.
Drawing direction
? Peel Back Force (Top Tape)
Chips
Bulk
160mm min
Leader
400mm min
Carrier tape
Top cover tape
Direction & angle of pull
0.05 – 0.7 N
0~15 °
? Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
? The missing of components shall be less than
0.1%
? Components shall not stick to the cover tape.
? The cover tape shall not protrude beyond the
edges of the carrier tape and shall not cover the
sprocket holes.
? Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
Paper Carrier Tape & Reel
Top cover tape
Pitch hole
Plastic Carrier Tape & Reel
Top cover tape
Pitch hole
Bottom cover tape
Paper carrier tape
Plastic carrier tape
10,000
Case Code
JIS EIA
C2012 CC0805
Chip
Thickness
0.85 mm
1.25 mm
Taping Material
Paper/Plastic
Plastic
Chip quantity (pcs.)
φ178mm (7”) reel φ330mm (13”) reel
4,000
2,000
C3216
CC1206
1.15 mm
1.30 mm
Plastic
2,000
10,000
1.60 mm
8,000
1.15 mm
1.60 mm
2,000
10,000
8,000
C3225
CC1210
2.00 mm
2.30 mm
Plastic
1,000
5,000
2.50 mm
C4532
CC1812
1.60 mm
2.00 mm
Plastic
1,000
3,000
2.30 mm
1.60 mm
500
1,000
C5750
CC2220
2.00 mm
2.30 mm
Plastic
500
3,000
2.80 mm
2,000
TDK MLCC US Catalog
Page 193
Version B11
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